• Feature: SOI & Design (ARM, Synopsys, Mentor, IBM)

• Business & Technology (GSA/SOI Consortium survey, Yole, Soitec, Mattson, Raytheon, ST)

• Special Supplement: SOI Industry Consortium news

• Industry Buzz (ST & Debiotech, Intel, Hitachi & Renesas, Atmel, AMD, Toshiba, IBM, Rambus, Honeywell, Semico and more.)

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Applications

(Courtesy of ARM, IBM, and Soitec, August 2007)

It's ideal for a broad set of applictions

Mobile devices, where:
• lower dynamic power reduces the overall operating power for graphic-intensive mobile applications;
• RF design can strongly benefit from SOI substrate isolation and passive component enhancement;
• application processors target higher performance in tighter power envelopes for the next digital mobile experience.

Consumer electronics and gaming, where:
• smaller form factors are key;
• better thermal management is required;
• performance gains can simplify system designs.

Embedded markets, where:
• the emphasis is on performance, size, power and reliability especially under challenging conditions as found in automotive, industrial, and medical markets.

Dataprocessing including graphics and storage, where:
• SOI is intended to enable higher system performance, more cache memory, and better power envelope management, leading to cheaper packaging solutions.