NEW Filter our 213 articles by market or company:

• IBM, STM, Hitachi, Leti, Soitec on FD-SOI

• Special supplement: SOI Industry Consortium

• Medical apps: KEK, Hitachi, UCL, Nanosens

• IEEE fellows, Industry Buzz and more

» read the full edition

Follow us on Twitter

Stanford University Varian GLOBALFOUNDRIES Tyndall National Institute IBM Shin-Etsu Handotai Ritsumeikan University MIT Lincoln Laboratory MEMC Semico

IMEC Infotech Synopsys UMC Mentor Graphics Samsung Kanazawa Institute of technology Berkeley, University of California CEA-Leti STMicroelectronics

KLA-Tencor Corporation BroadPak ARM Cadence Design Systems NVIDIA University of Southern California Universitι Catholique de Louvain Freescale Semiconductor Soitec Semico

Applications

(Courtesy of ARM, IBM, and Soitec, August 2007)

It's ideal for a broad set of applictions

Mobile devices, where:
• lower dynamic power reduces the overall operating power for graphic-intensive mobile applications;
• RF design can strongly benefit from SOI substrate isolation and passive component enhancement;
• application processors target higher performance in tighter power envelopes for the next digital mobile experience.

Consumer electronics and gaming, where:
• smaller form factors are key;
• better thermal management is required;
• performance gains can simplify system designs.

Embedded markets, where:
• the emphasis is on performance, size, power and reliability especially under challenging conditions as found in automotive, industrial, and medical markets.

Dataprocessing including graphics and storage, where:
• SOI is intended to enable higher system performance, more cache memory, and better power envelope management, leading to cheaper packaging solutions.