• Implementation guide

• Annual Event presentations

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Download the presentations of the October 21, 2009 conference.

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The SOI Design Experience

• Special supplement: SOI Industry Consortium

• ARM11, Cadence, Freescale, Voldman/ESD and more

• Toshiba's Cell Regza TV

» read the full edition

Berkeley, University of California Shin-Etsu Handotai UMC STMicroelectronics Stanford University IBM Samsung Tyndall National Institute Varian Lam Research

GLOBALFOUNDRIES Cadence Design Systems Freescale Semiconductor Universitι Catholique de Louvain CEA-Leti NVIDIA Magma Design Automation ARM Semico Applied Materials

Kanazawa Institute of technology Ritsumeikan University Innovative Silicon IMEC Infotech KLA-Tencor Corporation AMD Mentor Graphics Chartered Semiconductor Manufacturing Soitec

Synopsys GLOBALFOUNDRIES Innovative Silicon AMD Ritsumeikan University NVIDIA Semico STMicroelectronics Mentor Graphics Soitec

Applications

(Courtesy of ARM, IBM, and Soitec, August 2007)

It's ideal for a broad set of applictions

Mobile devices, where:
• lower dynamic power reduces the overall operating power for graphic-intensive mobile applications;
• RF design can strongly benefit from SOI substrate isolation and passive component enhancement;
• application processors target higher performance in tighter power envelopes for the next digital mobile experience.

Consumer electronics and gaming, where:
• smaller form factors are key;
• better thermal management is required;
• performance gains can simplify system designs.

Embedded markets, where:
• the emphasis is on performance, size, power and reliability especially under challenging conditions as found in automotive, industrial, and medical markets.

Dataprocessing including graphics and storage, where:
• SOI is intended to enable higher system performance, more cache memory, and better power envelope management, leading to cheaper packaging solutions.