SOI Applications

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SOI Fundamentals

Chris Edwards explores the 'tricks' semiconductor device manufacturers are using to cope with shrinking feature sizes
[New Electronics]

SOI Technology
[ISU Electrical and Computer Engineering Archives]

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Process Technology

SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]

Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]

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Photonics

Ultra-high Speed, All-optical Wavelength Converters Using Single SOA and SOI Photonic Integrated Circuits
We report a new family of ultra-fast all-optical wavelength converters. The device architecture employs a single SOA and filtering elements integrated in silicon-on-insulator substrates. These schemes enable high-integration density and low power consumption. [Department of Information Technology (INTEC), Ghent University]

Device engineering for silicon photonics
[NPG Asia Materials]

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Power

A new integrated SOI power device based on self-isolation technology
[State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China]

NXP has launched the UBA2024 and UBA2024A integrated half-bridge power ICs, based on the company’s EZ-HV SOI technology
They enable the easy design of low-cost, very compact, high-reliability, long-life florescent lamp (CFL) applications. [NXP]

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Sensors/MEMS

How an SOI MEMS are built : MEMS first™ process
[SiTime]

A 12GHz bulk-micromachined RF-MEMS phase shifter by SOI layer-separation design
[IEICE Electronics Express]

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3D integration

Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin [Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]

Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability [EV Group (EVG)]

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Last post on February 03, 2012:

STMicroelectronics predicts its new SOI-based STOD13AS power chip could be used in nearly every new smartphone or small electronic device that has an AMOLED display

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#18 - Fall/Winter 2011/12
SOI on the Roadmaps

FD-SOI: ST & 28nm SOCs; ARM & design porting
Apps – NXP automotive sensors, AMD 32nm Bulldozer
SOI Conference (IBM, Intel, Leti, GloFo, ST, ARM, Peregrine & more)
SOI Consortium – FD-SOI whitepaper overview & excerpts

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Benefits of SOI

(Courtesy of ARM, IBM, and Soitec, August 2007)

SOI provides significant PPA advantages over bulk CMOS for digital applications using standard EDA flows and physical IP.

SOI CMOS technical benefits compared to bulk CMOS:

Higher performance	Lower power	Area savings	High reliability
Reduced junction capacitance translates into faster transistor ON/OFF switching speed	SOI circuit higher performance capability allows voltage (Vdd) reduction	Synthesis tool picks samller cell in SOI to achieve a given speed in digital design	Reduced susceptibility to electro-magnetic interference
Boost effect of floating body during transistions	Smaller cells needed to achieve the same performance	No wells, no taps, no latchup in SOI, enables denser layout	Reduced soft error rates (SER)
No reverse substrate bias effect in cells using stacked transistors	Reduced junction capacitance	SOI eDRAM provides high-density memory	SOI circuits are capable of withstanding higher temperatures (~300°C)

• higher performance at the same power
• lower dynamic power for the same performance

It's ideal for a broad set of applications

Mobile devices, where:
• lower dynamic power reduces the overall operating power for graphic-intensive mobile applications;
• RF design can strongly benefit from SOI substrate isolation and passive component enhancement;
• application processors target higher performance in tighter power envelopes for the next digital mobile experience.

Consumer electronics and gaming, where:
• smaller form factors are key;
• better thermal management is required;
• performance gains can simplify system designs.

Embedded markets, where:
• the emphasis is on performance, size, power and reliability especially under challenging conditions as found in automotive, industrial, and medical markets.

Dataprocessing including graphics and storage, where:
• SOI is intended to enable higher system performance, more cache memory, and better power envelope management, leading to cheaper packaging solutions.