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#15 - Summer 2010
Getting ready for FD-SOI

• IBM, STM, Hitachi, Leti, Soitec on FD-SOI

• Special supplement: SOI Industry Consortium

• Medical apps: KEK, Hitachi, UCL, Nanosens

• IEEE fellows, Industry Buzz and more

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Berkeley, University of California Varian Tyndall National Institute STMicroelectronics MEMC Universitι Catholique de Louvain ARM Shin-Etsu Handotai Mentor Graphics Stanford University

UMC IBM Infotech CEA-Leti GLOBALFOUNDRIES Cadence Design Systems KLA-Tencor Corporation Kanazawa Institute of technology NVIDIA Samsung

MIT Lincoln Laboratory Ritsumeikan University Freescale Semiconductor University of Southern California Semico Synopsys BroadPak IMEC Soitec GLOBALFOUNDRIES

Economics articles

Dec. 4, 2009Driving SOI Cost Reductions
With cost savings leveraged across the board, prices are coming down significantly. By Dr. Jocelyne Wasselin, VP Marketing & Business Development, Soitec.
[Advanced Substrate News]

Jul. 30, 2009Rooted in Green
SOI and other engineered substrates drive power efficiency through the value chain. By Dr. Jocelyne Wasselin, VP Business Development, Soitec.
[Advanced Substrate News]

Apr. 6, 2006Semico analyzes Cost-of-Ownership (COO)
[Advanced Substrate News]