Chris Edwards explores the 'tricks' semiconductor device manufacturers are using to cope with shrinking feature sizes
[New Electronics]

SOI Technology
[ISU Electrical and Computer Engineering Archives]

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SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]

Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]

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ST: FD-SOI for Competitive SOCs at 28nm and Beyond
[Advanced Substrate News]

Power, Performance, Cost. FDSOI lets you pick any three. Want proof? How about an ARM Cortex-M0 processor core example?
[EDA360 Insider]

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Video interview of David Desharnais (Cadence) by Jeff Wolf (SOI Industry Consortium)
[Chipestimate.tv]

Cadence Announces Comprehensive SOI Design Hub
[Cadence]

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Peregrine's New SP5T RF Switch Offers High Isolation for Infrastructure Apps
[Consumer Electronics Net]

RF Micro Devices(R) Introduces First Silicon Switches for 3G Smartphones and Other High Performance Applications
[RF Micro Devices]

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Ultra-high Speed, All-optical Wavelength Converters Using Single SOA and SOI Photonic Integrated Circuits
We report a new family of ultra-fast all-optical wavelength converters. The device architecture employs a single SOA and filtering elements integrated in silicon-on-insulator substrates. These schemes enable high-integration density and low power consumption. [Department of Information Technology (INTEC), Ghent University]

Device engineering for silicon photonics
[NPG Asia Materials]

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A new integrated SOI power device based on self-isolation technology
[State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China]

NXP has launched the UBA2024 and UBA2024A integrated half-bridge power ICs, based on the company’s EZ-HV SOI technology
They enable the easy design of low-cost, very compact, high-reliability, long-life florescent lamp (CFL) applications. [NXP]

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How an SOI MEMS are built : MEMS first™ process
[SiTime]

A 12GHz bulk-micromachined RF-MEMS phase shifter by SOI layer-separation design
[IEICE Electronics Express]

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Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin [Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]

Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability [EV Group (EVG)]

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