SOI Applications

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Updated: June 6, 2013

SOI Fundamentals

Process Technology

SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]

Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]

> More articles

Fully Depleted SOI

Design/IP

Analog/HV/RF

High Voltage and High Reliability Silicon-on-Insulator Power IC Technologies and Their Application to 750 V 4.5 A Micro-Inverter IC
[Japanese Journal of Applied Physics 51 (2012)]

Smart power saves power
ST’s newest SOI-based smart power technology delivers big reductions in power consumption in medical equipment, hybrid-electric-vehicle chargers and more. [Advanced Substrate News]

> More articles

Photonics

Imec and Genalyte have successfully developed and produced a set of disposable SOI-photonics biosensor chips for Genalyte’s diagnostic and molecular detection equipment
[Advanced Substrate News]

Photonics on the Move
SOI is at the heart of silicon photonics. Here’s an overview of past, present and future trends. [Advanced Substrate News]

> More articles

Power

Sensors/MEMS

3D integration

Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin [Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]

Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability [EV Group (EVG)]

> More articles

Advanced Substrate News

Last post on June 17, 2013:

American Semiconductor has announced the FleX-MCUâ„¢ product family.

> Read this post

#20 – Fall/Winter 2012/13
The Move to Fully-Depleted: Manufacturing, Economics, Design

  • FD-SOI: ST/Chery interview; CMP's MPW runs; IBS on cost-savings
  • FD & wafers: SEH & Soitec
  • IBM's Fin-on-Oxide/FinFET
  • SOI Consortium – FD-SOI & wafer capacity for mobile

> Read the full edition

Presentations

Feb. 15, 2011Evaluation of Fully-Depleted SOI for next generation Mobile Consumer Chips
[Horacio Mendez, Executive Director, SOI Industry Consortium]

Jan. 28, 2010SOI - The next five years: The critical role that SOI will play in the semiconductor market
EuroSOI 2010 - Grenoble, France
[Horacio Mendez, Executive Director, SOI Industry Consortium]

Jul. 28, 2009SOI – Integrated Technology, IP and Design Flow for Customer Success
46th Design Automation Conference - San Francisco, CA, USA
[Gordon Starkey, IBM Systems & Technology Group; David Desharnais, Group Marketing Director, Cadence Design Systems; Tom Lantzch, VP Marketing, ARM]

Jul. 28, 2009Low-Power Design with Material Impact on Silicon-on-Insulator Technology
46th Design Automation Conference - San Francisco, CA, USA
[Horacio Mendez, Executive Director, SOI Industry Consortium]

Jul. 28, 2009The Truth About Power and Process Technology
46th Design Automation Conference - San Francisco, CA, USA
[Horacio Mendez, Executive Director, SOI Industry Consortium]

Apr. 9, 2009SOI technology & emerging applications
[Horacio Mendez, Executive Director, SOI Industry Consortium]