Power

May. 30, 2012NovaThor SmartPhone Chip on 28nm FD-SOI: ST-Ericsson Blogger Tells All; PC Mag Sees Light
[Advanced Substrate News]

Apr. 30, 2012Leti: Adding Strain to FD-SOI for 20nm and Beyond
[Advanced Substrate News]

Apr. 24, 2012ST White Paper Excerpts: Planar Fully-Depleted Silicon Technology to Design Competitive SOCs at 28nm and Beyond
STMicroelectronics recently issued a major white paper detailing the choice of FD-SOI for consumer SOCs at 28nm and beyond. This article excerpts some of the highlights.
[Advanced Substrate News]

Apr. 23, 2012Chenming Hu: SOI Can Empower New Transistors to 10nm and beyond
FinFET and FD-SOI transistors look different but share a common principal that allows MOSFETs to be scalable to 10nm gate length.
[Advanced Substrate News]

Apr. 20, 2012Soitec: Wafer Roadmap for Fully Depleted Planar and 3D/FinFET
[Advanced Substrate News]

Apr. 16, 2012Soitec provides affordable paths to higher performance, lower-power processors for mobile and consumer devices
[Soitec]

Apr. 6, 2012Interview With ST-Ericsson's Chief Chip Architect: SOCs on 28nm FD-SOI – When, Why and How
ST-Ericsson's Chief Chip Architect Louis Tannyeres talks with ASN about the move to 28nm FD-SOI for smartphones and tablet SOCs.
[Advanced Substrate News]

Mar. 13, 2012ST-Ericsson’s Next-gen NovaThor: This Year, at 28nm, on FD-SOI Wafers from Soitec
[Advanced Substrate News]

Dec. 6, 2011SiTime has recently added five more products to its line-up of SOI-MEMS-based timing solutions
[Advanced Substrate News]

Dec. 6, 2011SiTime has introduced its SiT500x family, the industry’s first Voltage Controlled, Temperature Compensated Oscillator (VCTCXO) products with ±0.5 PPM stability
[Advanced Substrate News]

Dec. 6, 2011Bulk logic designs for mobile apps port directly to FD-SOI
[Advanced Substrate News]

Dec. 6, 2011ST: FD-SOI for Competitive SOCs at 28nm and Beyond
[Advanced Substrate News]

Aug. 1, 2011Study Shows FD-SOI Most Cost-Effective Approach at 22nm
A new IC Knowledge report examines the costs of potential solutions for a foundry at 22nm.
[Advanced Substrate News]

May. 27, 2011FD-SOI: A Quick Backgrounder
For those new to FD-SOI, here’s a short description of the basic principles.
[Advanced Substrate News]

May. 27, 20115th FD-SOI Workshop (Taiwan)
Following the April 2011 VLSI-TSA and VLSI-DAT conferences in Hsinchu, Taiwan, the SOI Consortium hosted the fifth in its series of FD-SOI Workshops.
[Advanced Substrate News]

May. 27, 2011FD-SOI update
Data indicates that fully-depleted (FD) SOI offers an ideal combination for achieving ultra-low-power, high-performance and cost-effective manufacturability. Companies in the SOI Consortium are working together on furthering the development and technology evaluations.
[Advanced Substrate News]

May. 25, 2011FD-SOI: The Substrates Are Ready
At the most recent SOI Consortium FD-SOI workshop, Soitec gave a presentation on FD-SOI substrate readiness. Here are some of the highlights.
[Advanced Substrate News]

May. 14, 2011FD-SOI: The Right Choice
[Advanced Substrate News]

Apr. 6, 2011MEMS on SOI – Growing Fast and Faster
[Advanced Substrate News]

Mar. 11, 2011The SOI Papers at ISSCC 2011
[Advanced Substrate News]

Feb. 25, 2011Topple the Towers: Freescale’s SOI SoC in Alcatel-Lucent’s lightRadio

Feb. 10, 2011SOI Consortium’s phenomenal FD-SOI/ARM results
[Advanced Substrate News]

Jan. 13, 2011AMD’s New Fusion APU’s on 32nm SOI
[Advanced Substrate News]

Dec. 21, 2010ARM Tunes SOI SPICE for PPA

Dec. 13, 2010Newest Drivers Reach New Levels of Integration
[Advanced Substrate News]

Dec. 8, 2010SOI Conference Short Course
[Advanced Substrate News]

Dec. 8, 2010What’s new: Design Clinics now online
[Advanced Substrate News]

Dec. 8, 2010The FD SOI workshop series: A Big Success
Now in their second year, these information-packed workshops are bringing in the key decision makers, and gathering ecosystem support.
[Advanced Substrate News]

Dec. 8, 2010Self-Heating Effect and Variability in Gate-All-Around (GAA) Silicon Nanowire Transistors (SNWT)
Researchers in academia have partnered with industry to increase understanding of critical issues in advanced non-classical CMOS devices.
[Advanced Substrate News]

Dec. 8, 2010FD SOI: Movers & Shakers at Tokyo Workshop
The third installment in the SOI Consortium’s ongoing FD SOI Workshop series, the Tokyo event was a major success.
[Advanced Substrate News]

Dec. 8, 2010Right Timing
ARM’s verified the SOI SPICE models accuracy in its physical IP, helping designers to simulate their chips prior to tape-out as well as helping the foundries to tune their SOI SPICE models.
[Advanced Substrate News]

Dec. 8, 2010Wafers for Fully Depleted SOI Devices: Ready for Volume
A technological tour-de-force, Soitec’s wafers for FD SOI meet all the requirements
[Advanced Substrate News]

Aug. 15, 2010A new integrated SOI power device based on self-isolation technology
[State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China]

Jul. 26, 2010ARM/EETimes Virtual Conference
[Advanced Substrate News]

Jul. 26, 2010Jump Start SOI Training
[Advanced Substrate News]

Jul. 26, 2010The SOI IP Portal
[Advanced Substrate News]

Jul. 26, 2010Program Launch: Ready for SOI Technology
The goal is to build a visible, working IP ecosystem to support SOI adoption.
[Advanced Substrate News]

Jul. 26, 2010X-Ray Visionaries
Developed for use in high energy particle physics, applications for KEK’s new SOIPIX technology can also extend to medical imaging.
[Advanced Substrate News]

Jul. 26, 2010The Moment Is Now
Nobuyuki SUGII of Hitachi recounts why their thin-BOX SOI solution also benefits today's mainstream low-power nodes.
[Advanced Substrate News]

Jul. 26, 2010Conquering Convergence
Frederic BŒUF of STM and Claire FENOUILLET-BERANGER of Leti describe how their hybrid FD-SOI/bulk approach solves multi-media SoC challenges.
[Advanced Substrate News]

Jul. 26, 2010ETSOI Substrates: What We Need
Bruce DORIS of IBM explains the relationship between the device architecture and SOI wafer requirements.
[Advanced Substrate News]

Jul. 26, 2010Model Behavior
Olivier ROZEAU of CEA-Leti discusses SPICE-ready compact models for FD-SOI.
[Advanced Substrate News]

Jul. 26, 2010Using FD-SOI to Design Competitive Chips
Xavier CAUCHY of Soitec looks at why FD-SOI is interesting for competitive chip design.
[Advanced Substrate News]

Jul. 26, 2010Fully Depleted (FD) SOI for the Next Generation
FD-SOI: A Primer. What is it? What's it for? When will it hit?
[Advanced Substrate News]

Jun. 22, 2010Freescale Extends QorIQ Family with Quad-Core P3 Platform Optimized for Low Power
Manufactured in 45nm silicon-on-insulator process technology, the P3041 offers optimal integration and new intellectual property that delivers improved functionality for end products. The P3041 processor integrates four e500mc cores...
[EDACafé]

Jan. 22, 2010STMicroelectronics Introduces World’s Most Integrated High-Performance Ultrasound Pulse Controller
[STMicroelectronics]

Dec. 4, 2009Increased expectations, drastic reductions
A novel transistor design creates a new family of ultra-low power blocks – with consumption measured in sub-nanowatts. By Denis Flandre, Head of Microelectronics Lab, UC Louvain.
[Advanced Substrate News]

Dec. 4, 2009Multicore’s perfect balance
Freescale’s highly successful QorIQ™ line of communications processors leverages 45nm SOI for power & performance at the right price. By Mike Mendicino, Process Technology Director, Networking & Multimedia Group, Freescale.
[Advanced Substrate News]

Dec. 4, 2009Implementing the 45nm SOI ARM11
The mobile app chip’s 40% power saving was achieved without any major rework in design methodology. By Roma Rudra, Staff Design Engineer, ARM.
[Advanced Substrate News]

Dec. 4, 2009Digital implementation with SOI: go with the float
Off-the-shelf solutions eliminate SOI design-time overhead. By Dhananjay K. Griyage, Senior R&D Engineer and Michael Jacobs, Senior Product Manager, Cadence Design Systems.
[Advanced Substrate News]

Dec. 4, 2009IMEC has developed an SOI-MEMS actuator that runs on ultra-low power and is watertight
This makes the actuator especially suited for use in in-vivo biomedical applications as well as in any application that needs long autonomy and small batteries.
[Advanced Substrate News]

Nov. 23, 2009NXP’s GreenChip Brings Energy Efficiency to Netbook Adapters
NXP Semiconductors today announced the launch of GreenChip TEA1733(L) - a low-cost IC that increases energy efficiency and standby performance of power supplies under 75W.
[NXP]

Oct. 10, 2009NXP has launched the UBA2024 and UBA2024A integrated half-bridge power ICs, based on the company’s EZ-HV SOI technology
They enable the easy design of low-cost, very compact, high-reliability, long-life florescent lamp (CFL) applications.
[NXP]

Jul. 30, 2009A Novel Device for Ultra-Low Power & More
A leading figure in the research world, Professor Woo and his team are taking an innovative approach to taming the power challenge. By Jason Woo, Professor, UCLA.
[Advanced Substrate News]

Jul. 30, 2009EDN Innovation Winner 2008
This spring, the EDN magazine Innovation of the Year in Passive Components and Sensors was awarded to ADI’s SOI-MEMS based ADXL001 Industrial Vibration Sensor.
[Advanced Substrate News]

Jul. 30, 2009Interview of David Kress, director of Technical Marketing, Analog Devices: Innovation, Lower Leakage & Higher Performance
Analog Devices’ proprietary XF3 SOI SiGe complementary bipolar process enables them to address the trends toward reduced component cost, board area and power consumption — all while delivering unparalleled performance.
[Advanced Substrate News]

Jul. 30, 2009Celebrating Over A Decade of Green
Piet Wessels has been the driving force behind NXP’s (and formerly Philips’) SOI-enabled high-voltage business ever since it first began.
[Advanced Substrate News]

Jul. 30, 2009Low Power Design: Fast & Green
SOI helps create faster chips that consume less power. By Karen Bartleson, Sr. Director Community Marketing, Synopsys Inc.
[Advanced Substrate News]

Jul. 30, 2009IBM & SOI: Delivering on Customer Priorities
How IBM’s Cu-45HP ASIC leverages SOI for an overall lowering of power. By Dr. Raj Singh, Senior Technical Staff Member & Communications Architect, IBM Microelectronics Division.
[Advanced Substrate News]

Jul. 30, 2009Energy-Efficient SoC Design Can Make A Difference
ARM now offers a combination of low-power processors, SOI libraries and power management IP. By Remy Pottier, Head of SOI Marketing and Business Development, ARM.
[Advanced Substrate News]

May. 27, 2009SiTime's line of ultra-small resonators target portable electronics
[Advanced Substrate News]

May. 12, 2009Freescale’s new SOI-based MPC8535E
The MPC8535E is a full-featured, high-performance, low-power processor designed to support fanless operation for power-sensitive networking, industrial and media processing applications. It is a Freescale Energy Efficiency product.
[Freescale]

Feb. 4, 2009A new suite of efficient power supply products including GreenChip PFC and SR controllers
Based on its 3rd generation of high-voltage SOI (EZ-HV) processes developed specially to handle power, analog and digital devices on a single die, NXP has announced: A new suite of efficient power supply products including GreenChip PFC and SR controllers to replace energy inefficient diode rectification circuits with cost efficient IC implementation in computing, consumer and industrial power supplies. With over 400 million products in the market, the GreenChip family makes it easier and more cost-effective for power supply manufacturers to comply with energy efficiency specifications such as 80PLUS® and ENERGY STAR®.
[NXP]

Dec. 3, 2008The new fanless KS6215 point-of-service (POS) terminals from Posiflex are based on VIA’s SOI-based C7 processor
The C7 offers the greatest performance per watt, enabling the quiet operation, less moving parts and lower power consumption required by the hospitality, healthcare, medical, retail and specialized markets.
[Advanced Substrate News]

May. 14, 2008Layman’s brief guide to FD vs PD SOI
[Advanced Substrate News]

Nov. 29, 2007Fujifilm continued its adoption of Kopin electronic viewfinders (EVFs)
Incorporating Kopin’s CyberEVF®230K into its new FinePix S8000fd SLR-styled camera.
[Kopin]

Oct. 31, 2007SOI at UMC
Vincent Liao article on 65nm pdk with ARM IP for SOCs on SOI at UMC
[Advanced Substrate News]

Apr. 23, 2007Oki ultraviolet (UV) sensor IC ML 8511
In Chinese cell phone.
[OKI]

Apr. 6, 2006Kopin/myvu
[Advanced Substrate News]

Jan. 1, 2006VIA Eden™ and Eden™ ULV processors (90nm)
[VIA Technologies]

Dec. 7, 2005Kopin/Kodak
Kopin's SOI-based CyberEVF(R) 230K viewfinders into Kodak EasyShare P-Series cameras.
[Advanced Substrate News]

Dec. 7, 2005Kopin/Scalar
[Advanced Substrate News]

Dec. 7, 2005NTT’s Ultralow-power MTCMOS/SOI technology
Enabling self-powered wireless transmission by just touching a terminal.
[Advanced Substrate News]

Dec. 7, 2005Seiko Instruments’ charge-pumping chip can leverage energy sources such as personal body heat and natural illumination
[Advanced Substrate News]

Sep. 26, 2005National Semiconductor credits SOI in VIP50 BiCMOS analog process technology
For dramatically improving the performance of its next-generation precision and low-power, low-voltage operational amplifiers, especially for industrial and automotive applications.
[National Semiconductor]

May. 27, 2005VIA launches VIA C7 processor
[VIA Technologies]

Apr. 18, 2005Soitec - SOI for RF & Low Power ICs
[Advanced Substrate News]

Apr. 18, 2005OKI Electric’s chipset at the heart of Casio’s atomic-solar watch
[Advanced Substrate News]

Apr. 10, 2005Soisic (ARM): how to use SOI for low-power applications
[Advanced Substrate News]