SOI Applications

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SOI Fundamentals

Process Technology

SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]

Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]

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Fully Depleted SOI

Design/IP

Analog/HV/RF

Photonics

Ultra-high Speed, All-optical Wavelength Converters Using Single SOA and SOI Photonic Integrated Circuits
We report a new family of ultra-fast all-optical wavelength converters. The device architecture employs a single SOA and filtering elements integrated in silicon-on-insulator substrates. These schemes enable high-integration density and low power consumption. [Department of Information Technology (INTEC), Ghent University]

Device engineering for silicon photonics
[NPG Asia Materials]

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Power

A new integrated SOI power device based on self-isolation technology
[State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China]

NXP has launched the UBA2024 and UBA2024A integrated half-bridge power ICs, based on the company’s EZ-HV SOI technology
They enable the easy design of low-cost, very compact, high-reliability, long-life florescent lamp (CFL) applications. [NXP]

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Sensors/MEMS

3D integration

Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin [Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]

Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability [EV Group (EVG)]

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Advanced Substrate News

Last post on February 16, 2012 by Adele HARS:

FD-SOI – A Look at Recent Consortium ResultsPart 1 of 3: Manufacturing

> Read this post

#18 - Fall/Winter 2011/12
SOI on the Roadmaps

  • FD-SOI: ST & 28nm SOCs; ARM & design porting
  • Apps – NXP automotive sensors, AMD 32nm Bulldozer
  • SOI Conference (IBM, Intel, Leti, GloFo, ST, ARM, Peregrine & more)
  • SOI Consortium – FD-SOI whitepaper overview & excerpts

> Read the full edition

Sensors/MEMS

Mar. 31, 2011How an SOI MEMS are built : MEMS first™ process
[SiTime]

Jan. 3, 2011A 12GHz bulk-micromachined RF-MEMS phase shifter by SOI layer-separation design
[IEICE Electronics Express]

Aug. 13, 2010Label-free biosensor array based on silicon-on-insulator ring resonators addressed using a WDM approach
By D.-X. Xu, M. Vachon, A. Densmore, R. Ma, A. Delâge, S. Janz, J. Lapointe, Y. Li, G. Lopinski, D. Zhang, Q. Y. Liu, P. Cheben, and J. H. Schmid
[Optics Letters, Vol. 35, Issue 16, pp. 2771-2773]

Jul. 15, 2010Integrated Optical Gas Sensors on Silicon-on-Insulator Platform
By N. A. Yebo, D. Taillaert, J. Roels, D. Lahem, M. Debliquy, Z. Hens, R. Baets
[Photonics Research Group, Department of Information Technology (INTEC) of Ghent University]

Jul. 8, 2008Sarnoff’s new SOI-based Ultra-Sense™
A low-cost, scalable method for manufacturing high-performance back-illuminated image sensors. Sensor designers and manufacturers can use this novel approach to achieve higher resolution, smaller pixel size, higher quantum efficiency (QE) and maximized system performance without incurring additional costs.
[Sarnoff]

Mar. 7, 2005Sandia/sensors
[Sandia]