SOI Applications

NEW Filter our 380 articles by market or company:

Updated: June 6, 2013

SOI Fundamentals

Bulk vs SOI FinFET
[SOI Industry Consortium]

Chris Edwards explores the 'tricks' semiconductor device manufacturers are using to cope with shrinking feature sizes
[New Electronics]

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Process Technology

SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]

Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]

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Smart power saves power
ST’s newest SOI-based smart power technology delivers big reductions in power consumption in medical equipment, hybrid-electric-vehicle chargers and more. [Advanced Substrate News]

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Photonics

Imec and Genalyte have successfully developed and produced a set of disposable SOI-photonics biosensor chips for Genalyte’s diagnostic and molecular detection equipment
[Advanced Substrate News]

Photonics on the Move
SOI is at the heart of silicon photonics. Here’s an overview of past, present and future trends. [Advanced Substrate News]

> More articles

Power

NovaThor SmartPhone Chip on 28nm FD-SOI: ST-Ericsson Blogger Tells All; PC Mag Sees Light
[Advanced Substrate News]

Leti: Adding Strain to FD-SOI for 20nm and Beyond
[Advanced Substrate News]

> More articles

Sensors/MEMS

SiTime: Using SOI Technology to Develop High-Performance MEMS Timing Solutions
A radical SOI-based approach puts SiTime at the top of the fast-growing silicon-based timing market. [Advanced Substrate News]

Imec and Genalyte have successfully developed and produced a set of disposable SOI-photonics biosensor chips for Genalyte’s diagnostic and molecular detection equipment
[Advanced Substrate News]

> More articles

3D integration

Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin [Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]

Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability [EV Group (EVG)]

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Last post on June 17, 2013:

American Semiconductor has announced the FleX-MCUâ„¢ product family.

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#20 – Fall/Winter 2012/13
The Move to Fully-Depleted: Manufacturing, Economics, Design

FD-SOI: ST/Chery interview; CMP's MPW runs; IBS on cost-savings
FD & wafers: SEH & Soitec
IBM's Fin-on-Oxide/FinFET
SOI Consortium – FD-SOI & wafer capacity for mobile

> Read the full edition

Articles, publications, books and short courses

May. 15, 2013Sheffield firm gets funding to develop low power SRAM for finfet processes
[Electronics Weekly]

Apr. 25, 2013Forum: FD-SOI Technology - April 22nd, 2013 - Hsinchu, Taiwan
The SOI Industry Consortium, IBM and GLOBALFOUNDRIES organized a forum focused on fully depleted technologies for highly energy-efficient System-on-Chip applications.
[SOI Industry Consortium]

Mar. 19, 2013DATE: FDSOI costs to match bulk by year end, says ST
[Tech Design Forum]

Mar. 15, 2013Can “Less than Moore” FDSOI provides better ROI for Mobile IC?
[SemiWiki]

Feb. 21, 2013ST runs cool 3GHz FD-SOI processors
[Electronics Weekly Magazine]

Feb. 20, 2013STMicroelectronics 28nm FD-SOI Technology Hits 3GHz Operating Speed
[ST Life.augmented]

Feb. 20, 2013London Calling: FDSOI clocks at 3GHz
[EE Times]

Feb. 5, 2013ARM rates FDSOI process as "good technology"
[EE Times]

Jan. 20, 2013ST plans for Dresden FDSOI production
[EE Times]

Dec. 15, 2012Altera eyes FDSOI process for FPGAs
[EE Times]

Dec. 12, 2012FDSOI roadmap renames next node as 14-nm
[EE Times]

Dec. 11, 201228-nm FDSOI is production ready, says ST
[EE Times]

Jul. 13, 2012SOI Parity with CMOS Good News for IP Designers
[ChipEstimate.com]

Jul. 12, 2012SOI Becomes Essential At 20nm
[Low-Power Engineering]

Jul. 11, 2012Ecosystem emerges around new moble chip tech
A consortium touting fully depleted silicon-on-insulator (FDSOI) technology for mobile computing applications presented a united front this week in promoting the process technology as a viable alternative to Intel’s FinFET manufacturing approach.
[EE Times]

May. 21, 20120.5 µW Sub-Threshold Operational Transconductance Amplifiers Using 0.15 µm Fully Depleted Silicon-on-Insulator (FDSOI) Process
[Journal of Low Power Electronics and Applications]

Apr. 16, 2012Soitec provides affordable paths to higher performance, lower-power processors for mobile and consumer devices
[Soitec]

Apr. 16, 2012Soitec outlines fully depleted product roadmap for advanced planar and three-dimensional transistors
[Soitec]

Apr. 6, 2012ST-Ericsson announces next-gen NovaThor at 28nm, on FD-SOI
[ST-Ericsson]

Mar. 13, 2012ST-Ericsson’s Next-gen NovaThor: This Year, at 28nm, on FD-SOI Wafers from Soitec
[Advanced Substrate News]

Dec. 6, 2011ST: FD-SOI for Competitive SOCs at 28nm and Beyond
[Advanced Substrate News]

Nov. 7, 2011Power, Performance, Cost. FDSOI lets you pick any three. Want proof? How about an ARM Cortex-M0 processor core example?
[EDA360 Insider]

Mar. 30, 2011Performance Evaluation of FD-SOI Mosfets for Different Metal Gate Work Function
[International Journal of VLSI Design & Communication Systems (VLSICS), Vol. 2, No. 1 ]

Mar. 13, 2011Reliability Evaluation of Fully Depleted SOI (FDSOI) Technology for Space Applications
[A. K. Sharma (NASA/GSFC) and A. Teverovsky (QSS Group, Inc.)]

Feb. 24, 2011Planar FD-SOI CMOS: The Competitive Advantage Mobile Silicon Technology
Only Planar Fully-Depleted SOI CMOS Technology will enable the optimal Power-Performance-Area-Cost and Time-to-Market balance you need for your next generation Mobile Product development.
[SOI Industry Consortium]

Feb. 15, 2011FD-SOI Technology Promises Power Advantages for Next-Generation Apps
[Mobile Dev & Design]

Feb. 15, 2011Evaluation of Fully-Depleted SOI for next generation Mobile Consumer Chips
[Horacio Mendez, Executive Director, SOI Industry Consortium]

Feb. 3, 2011MEMC SOI Capability and Fully Depleted SOI Readiness
[MEMC]

Dec. 30, 2010Advanced Depleted-Substrate Transistors: Single-gate, Double-gate and Tri-gate
Components Research, Logic Technology Development, Intel Corporation
[Intel]

Dec. 27, 2010Planar fully depleted SOI: the technological solution against variability
It is well known that the planar fully depleted silicon-on-insulator (SOI) (FDSOI) architecture is a technological booster of the CMOS performance, thanks to better electrostatics than devices on bulk. This article shows that it also greatly improves the variability of the electrical characteristics, thanks to an undoped channel. This leads to good matching performance.
[Solid State Technology]

Dec. 14, 2010Will Future Transistors Appear in Glorious 3D?
[The Applied Materials Blog]

Nov. 1, 2010Short course: Subthreshold-Operation FDSOI. Transistors for Ultralow-Power Electronics
[S. A. Vitale, 2010 IEEE International SOI Conference]

Oct. 10, 2010Fully Depleted SOI for evolutionary planar device scaling
by Carlos Mazure and Christophe Maleville, Soitec
[Soitec]

Jul. 21, 2010FDSOI Process Technology for Subthreshold-Operation Ultralow-Power Electronics
Silicon-on-insulator devices designed for optimum operation at 0.3 V promise longer operational life than conventional application-specific integrated circuits.
[By Steven A. Vitale, Peter W. Wyatt, Member IEEE, Nisha Checka, Jakub Kedzierski, and Craig L. Keast]

Jan. 1, 2006Book: Fully-Depleted SOI CMOS Circuits and Technology for Ultralow-Power Applications
31 of Japan's leading FD-SOI experts explain design for ultra-low-power applications. Leading experts expect the next-generation of device technology for ultra-low-power applications to be based on FD (fully-depleted) SOI MOSFETs. For circuit designers and university students who would like to learn about FD-SOI design, and get a basic understanding of the material technology and device physics, 31 experts from Japan have written a new textbook. It provides examples of unique circuit designs for ultra-low-power applications, as well as a brief history of SOI material technology and the basic operational mechanism of FD-SOI MOSFETs.
[by Sakurai, Takayasu, Matsuzawa, Akira, Douseki, Takakuni, 2006, XV, 411 p., Hardcover, ISBN: 978-0-387-29217-5]