• Feature: SOI & Design (ARM, Synopsys, Mentor, IBM)
• Business & Technology (GSA/SOI Consortium survey, Yole, Soitec, Mattson, Raytheon, ST)
• Special Supplement: SOI Industry Consortium news
• Industry Buzz (ST & Debiotech, Intel, Hitachi & Renesas, Atmel, AMD, Toshiba, IBM, Rambus, Honeywell, Semico and more.)

Jul. 30, 2008 HIGHLIGHT NEWS
SOI Global Market Poised for Double-Digit Growth Through 2012
[VLSI Research Inc]
Jul. 30, 2008 Market for SOI to reach $1.1B by 2012, VLSI Research reports
[Electronic News]
Jul. 16, 2008 Soitec Ready With Ultrathin SOI Wafers
[Semiconductor International]
Jul. 4, 2008 CISSOID introduce a new High Temperature Logic Family
CISSOID, a leader in high temperature semiconductor solutions and the pioneer of Silicon-on-Insulator (SOI) products, announced its CHT-74 Logic Family for extreme temperatures. CHT-74 series fit market requirements for Oil & Gas, Aeronautics, Space and Automotive applications with a large temperature range from -55°C to 225°C. [CISSOID]
Jun. 17, 2008 Intel explores floating-body cells on SOI
[EE Times]
Jun. 5, 2008 Selete Achieves 5 GHz Pulses on Silicon Photonics IC
[Semiconductor International]
May. 28, 2008 IBM Unveils Three Energy-Efficient Servers Powered by Quad-Core AMD Opteron™ Processors
[AMD]
May. 13, 2008 45th Design Automation Conference Panels Cover Industry’s Varied Interests, Challenges, Direction, Future
Close to 30 Technical Programs, Pavilion Panels to be Held Over Four Days [Business Wire]
May. 5, 2008 Honeywell Announces New High Temperature Analog Silicon Chip for Aerospace and Deep Drilling Operations
[PRNewswire]
Apr. 22, 2008 Rambus announces IBM to license multi-protocol SerDes
[Rambus]
Apr. 8, 2008 Honeywell debuts ASICs, memory circuits in rad-hard SOI process
[EE Times]
Apr. 7, 2008 AMD unveils three chips for embedded systems
[EE Times]
Mar. 27, 2008 AMD Launches World’s First x86 Triple-Core Processors
[AMD]
Mar. 27, 2008 High Performance AMD Phenom™ X4 Processors Lead the Charge to HD Desktop Gaming and Video
[AMD]
Mar. 27, 2008 AMD Extends Energy-Efficient Processing Leadership with World’s First 65-Watt Quad-Core Desktop Processor
[AMD]
Mar. 25, 2008 Emerging materials on the Roadmap for silicon-based IC systems
[Solid State Technology]
Mar. 17, 2008 Telematics heralds self-driving car
[EE Times]
Mar. 11, 2008 IBM's Starkey: The case for SOI won't diminish w/ shrink
[Solid State Technology]
Mar. 4, 2008 AMD moves cautiously into the 45 nm era
[BetaNews]
Feb. 27, 2008 Toshiba Announces Low Voltage, Low Resistance Power MOSFETs For Notebook PC Battery Protection Circuit Module Applications
[Toshiba]
Feb. 26, 2008 Toshiba Announces Series Of High Voltage Single Chip Inverters For Brushless Motor Applications In Energy Saving Appliances
[Toshiba]
Feb. 25, 2008 Lightwire claims silicon photonics advance
[fibresystems]
Feb. 21, 2008 Advanced engineered substrates boost chip performance
[EUREKA]
Jan. 1, 2008 Executive Outlook: Driving Productivity, CoO in 2008
André-Jacques Auberton-Hervé, President and CEO, The Soitec Group [Semiconductor International]
Dec. 20, 2007 Innovative Silicon: a little company quietly upending the DRAM business
[EDN]
By Christine Raynaud, CEA-LETI / STMicroelectronics
For RF applications, SOI offers key advantages over bulk. It provides the ability to meet very low voltage and low noise applications, allows for improvement of passive devices and improves integration capabilities to reduce cost. This short course details the considerations for RF design with SOI.