Jul. 1, 2010 EDA Consolidation Continues
It too is expanding its product portfolio and launched a comprehensive silicon-on-insulator (SoI) Design Hub, a new Web portal that will help lower barriers to adoption of SoI technology by reducing initial start-up costs, reducing time ... [Sramana Mitra on Strategy]

Jul. 1, 2010 Ellison Makes Pressure Transducers Using Silicon on Sapphire
[SA Instrumentation & Control]

Jun. 23, 2010 AMD's Opteron 4100s march into x64 price war
Both chips are implemented in a 45 nanometer silicon on insulator process and manufactured by GlobalFoundries, the chip foundry that AMD spun out last year. [The Register]

Jun. 23, 2010 IBM 'fab club' aligns 28-nm process, jabs rival
Four companies in IBM Corp.’s ''fab club’’--IBM, Samsung, GlobalFoundries, and STMicroelectronics--said that they are in collaboration to ''synchronize’’ the production of chips, based on its previously-announced, 28-nm low-power process. GlobalFoundries will not ship a 32-nm bulk technology with high-k. Instead, it will ramp a 32-nm silicon-on-insulator (SOI) technology with high-k for a customer, namely Advanced Micro Devices Inc. Not long ago, AMD spun-off its manufacturing unit into a new company called GlobalFoundries. [EE Times]

Jun. 22, 2010 Freescale Extends QorIQ Family with Quad-Core P3 Platform Optimized for Low Power
Manufactured in 45nm silicon-on-insulator process technology, the P3041 offers optimal integration and new intellectual property that delivers improved functionality for end products. The P3041 processor integrates four e500mc cores... [EDACafé]

Jun. 9, 2010 Cadence Announces Comprehensive SOI Design Hub
[Cadence]

Jun. 8, 2010 Tegal Receives Repeat Order for Tegal 4200 SE Cluster Tool Silicon DRIE Process Module
[Tegal]

Jun. 2, 2010 Kilopass Announces Embedded Logic NVM for SoCs
Gusto Delivers 4Mb One-Time-Programmable Ultra-Secure Storage for Consumer and Mobile applications [Chip Design]

May. 31, 2010 Startup proposes SOI JFETs for low power
[EE Times]

May. 25, 2010 Gefran launches dedicated website for IMPACT series melt pressure sensors
[Process and Control Today]

May. 25, 2010 Peregrine's New SP5T RF Switch Offers High Isolation for Infrastructure Apps
[Consumer Electronics Net]

May. 25, 2010 Cadence agrees to help IBM make IP for 32-nm SOI
[EE Times]

May. 11, 2010 Peregrine to manufacture 180-nanometer silicon-on-sapphire CMOS RF integrted cicuits on IBM's 8-inch fab
[Military & Aerospace Electronics]

May. 10, 2010 IBM, Peregrine roll new Si-on-sapphire process
[EE Times]

May. 6, 2010 Optical switching: faster, smaller, and more frugal
[Compound Semiconductor]

May. 5, 2010 MEMS Piezoresistive Low Pressure Sensing Die
[Design World]

Apr. 20, 2010 Clare Introduces a New High-Voltage LED Driver With 8V to 550V Input Voltage Range and Greater Than 90% Efficiency
[EDACafé]

Apr. 13, 2010 The heart of the matter: Mayo Clinic team develops on SOI
[New Electronics]

Apr. 11, 2010 AMD's Turbo Core Technology
[PC Perspective]

Apr. 8, 2010 Singapore Launches Micro Electro Mechanical Systems Consortium
[Gov Monitor]

Apr. 7, 2010 Graphene Could Usher in New Silicon-based Photonic Circuitry
[Beyond Moore]

Mar. 31, 2010 ARM Keynote: Will ‘Dark Silicon’ Derail The Mobile Internet?
[Cadence]

Mar. 29, 2010 IBM demos graphene optical link
[NextGenLog]

Mar. 29, 2010 Designing With ARM--Looking back and looking forward
[Embedded]

Mar. 24, 2010 IBM, ARM and Cadence collaborate to provide chip and system designers access to key IP
[PC's Semiconductors Blog]

Mar. 23, 2010 China's CSMC Fab Sources SOI Substrates From France's Soitec
[China Sourcing News]

Mar. 23, 2010 Design Chain Solution for Silicon-on-Insulator Technology
[Chip design]

Mar. 23, 2010 Are *you* ready for Silicon-on-Insulator technology?
[TechBites.com]

Mar. 23, 2010 Major Semiconductor Companies Join Forces to Launch Design Chain Solution for Silicon-on-Insulator Technology
[EDACafé]

Mar. 23, 2010 Major Semiconductor Companies Join Forces to Launch Design Chain Solution for SOI Technology
[SOCcentral]

Mar. 22, 2010 ARM CTO warns of dark silicon
[Embedded.com]

Mar. 16, 2010 Soitec supplies SOI substrates to foundry CSMC
[EE Times]

Mar. 15, 2010 Looking ahead to designing with ARM
[Embedded.com]

Feb. 16, 2010 RF Micro Devices(R) Introduces First Silicon Switches for 3G Smartphones and Other High Performance Applications
[RF Micro Devices]

Feb. 16, 2010 Skyworks Introduces Family of GaAs and SOI Antenna Switch Modules for 2/3/4G Wireless Broadband and Mobile Handset Applications
[Skyworks]

Jan. 28, 2010 Remaking the design landscape
[System-Level Design]

Jan. 12, 2010 EUROSOI 2010 conference announces keynote presenters and technical program
[EUROSOI]

Nov. 27, 2009 Soitec CEO sees positive momentum in SOI markets
[EE Times]

Oct. 19, 2009 Leti's planar SOI technology suits low power 22nm node
[EE Times]

Oct. 16, 2009 Leti’s Planar-SOI Technology Meets Low-Power, 22nm Node Requirements, Supports Development of “Green” Products
[NanoTechWire.com]

Oct. 10, 2009 Designing for SoI with a standard flow, continued
[EDN]

Oct. 9, 2009 ARM 1176 in IBM SoI process demonstrates a cell-based flow
[EDN]

Sep. 16, 2009 Building an SOI IP/EDA Infrastructure
[Cadence]

Sep. 15, 2009 IBM Announces Highest Performance Embedded Processor for System-on-Chip Designs
[IBM]

Aug. 31, 2009 High-end server chips breaking records
[CNET News]

Aug. 31, 2009 Chartered to start 32nm pilot runs in 4Q09, sources say
[Digitimes]

Aug. 24, 2009 IBM's Power7 heats up server competition at Hot Chips
The 4-, 6- and 8-core Power7 drove the need for more memory, a change that took years of effort both in IBM's silicon-on-insulator process technology and in memory architecture. [EE Times]

Jul. 31, 2009 Smaller, cheaper cell phones possible
[PhysOrg.com]

Jul. 28, 2009 NXP Dual Channel Class-D Amplifiers Bring Power Efficient Concert Hall-Like Sound Into the Vehicle
[Business Wire]

Jul. 28, 2009 MOSIS Marks Expanded Semiconductor Foundry Offerings With Shuttle Runs for Silicon-On-Insulator (SOI)
[MOSIS]