NEW Filter our 377 articles by market or company:
Updated: May 22, 2013
Bulk vs SOI FinFET
[SOI Industry Consortium]
Chris Edwards explores the 'tricks' semiconductor device manufacturers are using to cope with shrinking feature sizes
[New Electronics]
SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]
Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]
Forum: FD-SOI Technology - April 22nd, 2013 - Hsinchu, Taiwan
[SOI Industry Consortium]
DATE: FDSOI costs to match bulk by year end, says ST
[Tech Design Forum]
GlobalFoundries to Fab 28/20nm FD-SOI Chips for ST; ST Technology Open to Other GF Customers
[Advanced Substrate News]
Leti: Adding Strain to FD-SOI for 20nm and Beyond
[Advanced Substrate News]
High Voltage and High Reliability Silicon-on-Insulator Power IC Technologies and Their Application to 750 V 4.5 A Micro-Inverter IC
[Japanese Journal of Applied Physics 51 (2012)]
Smart power saves power
ST’s newest SOI-based smart power technology delivers big reductions in power consumption in medical equipment, hybrid-electric-vehicle chargers and more.
[Advanced Substrate News]
Imec and Genalyte have successfully developed and produced a set of disposable SOI-photonics biosensor chips for Genalyte’s diagnostic and molecular detection equipment
[Advanced Substrate News]
Photonics on the Move
SOI is at the heart of silicon photonics. Here’s an overview of past, present and future trends.
[Advanced Substrate News]
NovaThor SmartPhone Chip on 28nm FD-SOI: ST-Ericsson Blogger Tells All; PC Mag Sees Light
[Advanced Substrate News]
Leti: Adding Strain to FD-SOI for 20nm and Beyond
[Advanced Substrate News]
SiTime: Using SOI Technology to Develop High-Performance MEMS Timing Solutions
A radical SOI-based approach puts SiTime at the top of the fast-growing silicon-based timing market.
[Advanced Substrate News]
Imec and Genalyte have successfully developed and produced a set of disposable SOI-photonics biosensor chips for Genalyte’s diagnostic and molecular detection equipment
[Advanced Substrate News]
Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin
[Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]
Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability
[EV Group (EVG)]

MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs.
#20 – Fall/Winter 2012/13
The Move to Fully-Depleted: Manufacturing, Economics, Design
SAFE HARBOR
The views and opinions expressed by the SOI Industry Consortium through officers in the SOI Industry Consortium or in this presentation or other communication vehicles are not necessarily representative of the views and opinions of individual members. Officers of the SOI Industry Consortium speaking on behalf of the Consortium should not be considered to be speaking for the member company or companies they are associated with, but rather as representing the views of the SOI Industry Consortium. Views and opinions are also subject to change without notice, and the SOI Industry Consortium assumes no obligation to update the information in this communication or accompanying discussions.
By accessing and browsing our Web site, you accept the following terms of use:
1. THE SITE
This website provides company information about the SOI Industry Consortium Inc.
This website belongs to the SOI Industry Consortium Inc, an American company located at 111 Huntington Avenue, Boston, MA 02199-7613 USA.
The person responsible for the publication on the website is Mr André-Jacques AUBERTON-HERVE, acting as President and Chairman of the Board of the SOI Industry Consortium Inc.
The hosting company, which is responsible for direct and permanent storage of the portal is 1&1 Internet Inc, located at 701 Lee Road, Suite 300, Chesterbrook, PA 19087 USA.
2. COMPLIANCE WITH COPYRIGHT AND TRADEMARK LAWS
The elements you see, hear or read on the Web site, as well as the Web site's form and substance, are subject to copyright protection. In no event may you use, distribute, copy, reproduce, modify, distort, or transmit the Web site or any of its elements, such as text, images or sounds without the prior written permission of the SOI Industry Consortium. the SOI Industry Consortium reserves the right to legally enforce any infringement of its intellectual property rights, including seeking criminal prosecution.
3. IMAGES DISPLAYED ON THE SITE
The images or photographs of people or places displayed on the Web site are either the property of, or used with permission by, the SOI Industry Consortium. The use of these images or photographs is prohibited unless specifically authorized by the SOI Industry Consortium. Any unauthorized use may violate copyright laws, trademark laws, the laws of privacy and publicity, or any other communications regulations.
4. GENERAL WARNING
The SOI Industry Consortium shall not be responsible for any damages arising out of your access to, or use of, the Web site, including any deterioration of, or viruses that may infect, your computer equipment or any other property. While the SOI Industry Consortium uses reasonable efforts to include accurate and up to date information on the Web site, we make no warranties or representations as to accuracy. The SOI Industry Consortium assumes no liability or responsibility for any error or omissions in the content of the Site.
5. LINKS TO OTHER SITES
The SOI Industry Consortium provides links from the Web site to other sites. The SOI Industry Consortium does not edit or control such sites. Links to such sites shall, in no event, constitute an endorsement by or an association between the SOI Industry Consortium and such sites and the SOI Industry Consortium shall not be responsible for any content, products, services, advertising or other matter presented on such sites. We remind you that access to, and use of, any sites is subject to their own terms of use and privacy policies.
6. COMPLIANCE WITH LAWS
The Web site is operated by the SOI Industry Consortium whose principal office is located in the USA. Internet users accessing this Web site from outside of the USA are responsible for compliance with any applicable local laws.
7. ACCESS TO THE WEB SITE
The SOI Industry Consortium reserves the right, for any reason, in its sole discretion, to terminate, change, suspend or interrupt access, in whole or in part, to the Web site, including its contents, features, or hours of availability without notice. You acknowledge and agree that in connection with the use of the Web site you must provide for your own equipment, at your own cost, necessary to access the World Wide Web.
8. PROTECTION OF PERSONAL INFORMATION
For more information on our policies with respect to privacy protection please read our Privacy Policy.
9. MODIFICATION OF TERMS
The SOI Industry Consortium reserves the right to modify or update the present terms of use at any time without notice, so you are encouraged to review them from time to time.
PRESENTATION Forum: FD-SOI Technology - April 22nd, 2013 - Hsinchu, Taiwan
[SOI Industry Consortium]
EVENT FD-SOI Workshop 2013 - June 15, 2013 - Kyoto, Japan
[SOI Industry Consortium]
PRESENTATION Symposium: Fully Depleted Transistors Technology - December 10, 2012 – San Francisco, CA
[SOI Industry Consortium]
WHITE PAPER White paper: Innovative wafers for energy-efficient CMOS technology
WHITE PAPER White paper: Economic impact of the technology choices at 28nm/20nm
ARTICLE DAC 2012: video interview of Horacio Mendez, Executive Director, SOI Industry Consortium
[EDACafe.com]