SOI Applications

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SOI Fundamentals

Chris Edwards explores the 'tricks' semiconductor device manufacturers are using to cope with shrinking feature sizes
[New Electronics]

SOI Technology
[ISU Electrical and Computer Engineering Archives]

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Process Technology

SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]

Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]

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Fully Depleted SOI

ST: FD-SOI for Competitive SOCs at 28nm and Beyond
[Advanced Substrate News]

Power, Performance, Cost. FDSOI lets you pick any three. Want proof? How about an ARM Cortex-M0 processor core example?
[EDA360 Insider]

> More articles

Design/IP

Video interview of David Desharnais (Cadence) by Jeff Wolf (SOI Industry Consortium)
[Chipestimate.tv]

Cadence Announces Comprehensive SOI Design Hub
[Cadence]

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Analog/HV/RF

Peregrine's New SP5T RF Switch Offers High Isolation for Infrastructure Apps
[Consumer Electronics Net]

RF Micro Devices(R) Introduces First Silicon Switches for 3G Smartphones and Other High Performance Applications
[RF Micro Devices]

> More articles

Photonics

Ultra-high Speed, All-optical Wavelength Converters Using Single SOA and SOI Photonic Integrated Circuits
We report a new family of ultra-fast all-optical wavelength converters. The device architecture employs a single SOA and filtering elements integrated in silicon-on-insulator substrates. These schemes enable high-integration density and low power consumption. [Department of Information Technology (INTEC), Ghent University]

Device engineering for silicon photonics
[NPG Asia Materials]

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Power

A new integrated SOI power device based on self-isolation technology
[State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China]

NXP has launched the UBA2024 and UBA2024A integrated half-bridge power ICs, based on the company’s EZ-HV SOI technology
They enable the easy design of low-cost, very compact, high-reliability, long-life florescent lamp (CFL) applications. [NXP]

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Sensors/MEMS

How an SOI MEMS are built : MEMS first™ process
[SiTime]

A 12GHz bulk-micromachined RF-MEMS phase shifter by SOI layer-separation design
[IEICE Electronics Express]

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3D integration

Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin [Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]

Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability [EV Group (EVG)]

> More articles

Advanced Substrate News

Last post on February 03, 2012:

STMicroelectronics predicts its new SOI-based STOD13AS power chip could be used in nearly every new smartphone or small electronic device that has an AMOLED display

> Read this post

#18 - Fall/Winter 2011/12
SOI on the Roadmaps

  • FD-SOI: ST & 28nm SOCs; ARM & design porting
  • Apps – NXP automotive sensors, AMD 32nm Bulldozer
  • SOI Conference (IBM, Intel, Leti, GloFo, ST, ARM, Peregrine & more)
  • SOI Consortium – FD-SOI whitepaper overview & excerpts

> Read the full edition

Consortium in the news

May. 16, 2011 Kissing or Cussing Cousins? Will FinFET and FD-SOI technology battle or co-exist peacefully?
[EEJournal]

Feb. 15, 2011 FD-SOI Technology Promises Power Advantages for Next-Generation Apps
[Mobile Dev & Design]

Feb. 14, 2011 SOI Consortium unveils FD-SOI results based on ARM processor
[ElectroIQ]

Feb. 10, 2011 Fully depleted SOI shows its stuff in CPU design
[EDN]

Feb. 10, 2011 SOI group moves on mobile front
[EE Times]

Feb. 10, 2011 Fans of New Chip-Making Style Hope to Step Out Soon
[The Wall Street Journal]

Sep. 1, 2010 Event: FDSOI Workshop on Sept. 25, 2010 at the University of Tokyo, Japan
[Organized by the University of Tokyo, the SOI Industry Consortium and Soitec]

Aug. 23, 2010 Is SOI the Holy Grail solution for addressing the power gap in advanced SoC designs?
[ARM Community Blogs]

Jun. 23, 2010 SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]

Jun. 9, 2010 Cadence Announces Comprehensive SOI Design Hub
[Cadence]

May. 24, 2010 Cadence, IBM team for 32-nm SOI IP
[EDN]

Apr. 7, 2010 Getting IP, Tools, And People “Ready For SOI”
[Cadence]

Apr. 6, 2010 The Time is Right for SOI Technology Adoption
[ChipEstimate.com]

Mar. 23, 2010 Design Chain Solution for Silicon-on-Insulator Technology
[Low-Power Design]

Mar. 23, 2010 Consortium rallies IP vendors behind SoI
[EDN]

Mar. 23, 2010 ARM, IBM, Cadence build SOI IP ecosystem
[EE Times]

Mar. 23, 2010 Major Semiconductor Companies Join Forces To Launch Design Chain Solution For Silicon-On-Insulator Technology
[PitchEngine]

Mar. 23, 2010 Education to reduce barriers to SOI adoption
[EE Times]

Mar. 23, 2010 IBM, ARM and Cadence act to make SOI chips cost-effective
[Electronics Weekly]

Dec. 4, 2009 ASN 14 Special Supplement: Soi Industry Consortium
[Advanced Substrate News]

Nov. 24, 2009 Mentor joins SOI consortium
[EE Times]

Nov. 13, 2009 Mentor joins SOI Industry Consortium
[EDN]

Nov. 13, 2009 Mentor Graphics joins SOI consortium
[EE Times]

Nov. 1, 2009 Comparing SOI and bulk FinFETs: Performance, manufacturing variability, and cost
[Solid State Technology]

Oct. 13, 2009 ARM teaches world how to use SOI process technology
[Electronics Weekly]

Oct. 8, 2009 ARM forces rethink on low-power process technology
[Electronics Weekly]

Oct. 8, 2009 ARM reports 45-nm SOI test chip with 40% power-saving
[EE Times]

Oct. 8, 2009 ARM Announces 45nm SOI Test Chip Results That Demonstrate Potential 40 Percent Power Savings Over Bulk Process
[ARM]

Sep. 14, 2009 Green Electronics – Is SOI The Answer?
[Cadence]

Aug. 20, 2009 SOI Industry Consortium stalks the “green thing”
[EDN]

Jul. 30, 2009 ASN 13 Special Supplement: Soi Industry Consortium
[Advanced Substrate News]

Jul. 28, 2009 SOI Makes Electronics Simply Greener
[ECN Asia]

Jul. 27, 2009 SOI group eyes 3D, green benefits
[Solid State Technology]

Jul. 24, 2009 SOI to save energy?
[New Electronics]

Jul. 22, 2009 Consortium Touts SOI's Green Credentials
[ITBusinessEdge.com]

Jul. 22, 2009 SoI Industry Consortium stalks the Green Thing
[EDN]

Jul. 22, 2009 Consortium pitches SOI's green credentials
[EE Times]

Jul. 22, 2009 SOI could chop $800 billion from US power bills
[TG Daily]

Jul. 22, 2009 Old Chip Tech Establishes Its Green Credentials
[Greentech Media]

Jun. 18, 2009 Three prestigious universities join SOI Industry Consortium
[Fabtech]

May. 27, 2009 ASN 12 Special Supplement: Soi Industry Consortium
[Advanced Substrate News]

Mar. 18, 2009 SOI coming into its own
[Compute Scotland]

Mar. 15, 2009 SOI draws line in the sand
[EuroAsia Semiconductor]

Mar. 13, 2009 Plumbing 101: Current Leakage And What to Do About It
[Low-Power Design Community]

Dec. 3, 2008 ASN 11 Special Supplement: Soi Industry Consortium
[Advanced Substrate News]

Nov. 20, 2008 SOI Goes Mainstream
[System Level Design Community]

Nov. 14, 2008 IC downturn in 'unknown territory,' says Soitec CEO
[EE Times]

Nov. 10, 2008 IBM rolls 45-nm SOI foundry service
[EE Times]

Nov. 10, 2008 IBM intros 45-nm SOI foundry offering, maintains SOI competitive benefits to bulk CMOS
[Electronic News]

Sep. 16, 2008 SOI offers early chapters for unconverted
[Compute Scotland]

Sep. 16, 2008 SOI consortium offers promotional guide book
[EE Times]

Jul. 17, 2008 SOI gathers steam
[EE Times]

Jul. 16, 2008 ASN 10 Special Supplement: Soi Industry Consortium
[Advanced Substrate News]

Jul. 16, 2008 NVIDIA joins SOI Industry Consortium as 23rd member
[Fabtech]

Jul. 16, 2008 Nvidia to Explore SOI Manufacturing Technology
[X-bit labs]

Jun. 29, 2008 Semiconductor companies eye SOI advantages and obstacles
[SCDsource]

May. 14, 2008 ASN 9 Special Supplement: Soi Industry Consortium
[Advanced Substrate News]

Mar. 20, 2008 Soitec: Now is opportune time for China to benefit from SOI
[EDN]

Mar. 10, 2008 SOI Industry Consortium welcomes Magma as 21st member
[Fabtech]

Feb. 20, 2008 Applied Materials joins SOI consortium
[EE Times]

Feb. 19, 2008 Applied joins SOI effort
[EDN]

Jan. 16, 2008 Silicon-on-insulator targets IC design mainstream
[SCDsource]

Jan. 15, 2008 SOI Consortium elects first board of directors
[EE Times]

Oct. 31, 2007 ASN 8 - The Launching of the SOI Industry Consortium
[Advanced Substrate News]

Oct. 15, 2007 Mobile market could see SOI demand boost, says Gartner
[Fabtech]

Oct. 12, 2007 Electronics leaders launch SOI Industry Consortium
[Small Times]

Oct. 10, 2007 SOI Industry Consortium Formed to Accelerate SOI Innovation
[Tech-On!]

Oct. 10, 2007 ARM in Group to Speed up Silicon-On-Insulator Innovation
[IQ Online]

Oct. 10, 2007 Consortium formed to promote SOI technology
[EE Times Asia]

Oct. 9, 2007 SOI Consortium launched
[Fabtech]

Oct. 9, 2007 Consortium formed to speed SOI opportunities
[EuroAsia Semiconductor]

Oct. 9, 2007 The semiconductor industry has finally worked out that some technologies are just too big for one company to keep to itself
[Electronicstalk]

Oct. 9, 2007 Silicon-on-insulator consortium formed to accelerate adoption
[EDN]

Oct. 9, 2007 French Stocks Advance; TF1, M6, Sanofi-Aventis Shares Gain
[Bloomberg]

Oct. 9, 2007 Industry Leaders Launch SOI Consortium
[Electronic Design]

Oct. 9, 2007 Consortium plans to push SOI
[The Institution of Engineering and Technology]

Oct. 9, 2007 SOI gets industry boost
[New Electronics]

Oct. 8, 2007 Soitec welcomes industry-wide effort to accelerate SOI innovation into broad markets
[The Soitec Group]

Oct. 8, 2007 Innovative Silicon Inc. Joins SOI Industry Consortium as a Founding Member
[Innovative Silicon]

Oct. 8, 2007 Chipmakers, partners join to push SOI use
[Solid State Technology]

Oct. 8, 2007 Group forms SOI consortium
[EE Times]