SOI Applications

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SOI Fundamentals

Chris Edwards explores the 'tricks' semiconductor device manufacturers are using to cope with shrinking feature sizes
[New Electronics]

SOI Technology
[ISU Electrical and Computer Engineering Archives]

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Process Technology

SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]

Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]

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Photonics

Ultra-high Speed, All-optical Wavelength Converters Using Single SOA and SOI Photonic Integrated Circuits
We report a new family of ultra-fast all-optical wavelength converters. The device architecture employs a single SOA and filtering elements integrated in silicon-on-insulator substrates. These schemes enable high-integration density and low power consumption. [Department of Information Technology (INTEC), Ghent University]

Device engineering for silicon photonics
[NPG Asia Materials]

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Power

A new integrated SOI power device based on self-isolation technology
[State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China]

NXP has launched the UBA2024 and UBA2024A integrated half-bridge power ICs, based on the company’s EZ-HV SOI technology
They enable the easy design of low-cost, very compact, high-reliability, long-life florescent lamp (CFL) applications. [NXP]

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Sensors/MEMS

How an SOI MEMS are built : MEMS first™ process
[SiTime]

A 12GHz bulk-micromachined RF-MEMS phase shifter by SOI layer-separation design
[IEICE Electronics Express]

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3D integration

Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin [Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]

Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability [EV Group (EVG)]

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Last post on February 03, 2012:

STMicroelectronics predicts its new SOI-based STOD13AS power chip could be used in nearly every new smartphone or small electronic device that has an AMOLED display

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#18 - Fall/Winter 2011/12
SOI on the Roadmaps

FD-SOI: ST & 28nm SOCs; ARM & design porting
Apps – NXP automotive sensors, AMD 32nm Bulldozer
SOI Conference (IBM, Intel, Leti, GloFo, ST, ARM, Peregrine & more)
SOI Consortium – FD-SOI whitepaper overview & excerpts

> Read the full edition

Press releases

Major semiconductor companies join forces to launch design chain solution for silicon-on-insulator technology

IBM, ARM and Cadence Collaborate to Provide Chip and System Designers Access to Key IP

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Boston, MASS., March 23, 2010 – The SOI Industry Consortium today announced the launch of its “Ready for SOI Technology” program, a global initiative to broaden access to energy-efficient silicon-on-insulator (SOI) technology for the electronics industry. With this program an initial offering of SOI intellectual property has been provided by IBM, ARM, and Cadence Design Systems. More IP has been added by Boeing and Synopsys, with an invitation extended to other developers to add to the growing SOI IP ecosystem.

SOI process technology can provide up to 30 percent chip performance improvement and 40 percent power reduction compared to bulk silicon technology. SOI is widely used today in market leading products found in data centers, offices, vehicles, homes and elsewhere in applications for computing, storage and networking, as well as for graphics-intensive game consoles. The Ready for SOI program is now making necessary design building blocks available to a broader population of chip designers seeking to harness SOI technology’s benefits for new applications, including mobile and consumer products.

A key enabler for this effort is the new SOI Portal hosted on the popular ChipEstimate.com site at www.ChipEstimate.com/SOI. The SOI Portal provides chip designers access to available design building blocks and to the companies supporting chip development on SOI processes.

“ChipEstimate.com has become a critical resource to over 26,000 registered SoC designers by providing central access to over 200 of the world’s largest IP suppliers and foundries,” said Adam Traidman, General Manager at Cadence. “Our new SOI micro-site will serve as an invaluable resource to designers wishing to explore the benefits of SOI technology for their chip design projects.”

To help IP and chip designers transition to SOI, the Ready for SOI program is sponsoring SOI Jump Start Training – register here >>>. This special training event will be hosted by Cadence on April 28, 2010 at the Cadence Engineering Center Auditorium, in San Jose, CA. Jump Start Training will also be available as both a live and recorded webcast.

“We are removing a barrier to industry adoption by giving all chip designers access to the benefits of SOI, not just those working for integrated device manufacturers and high-end ASIC developers,” said Horacio Mendez, executive director of the SOI Industry Consortium. “Through the enablement provided by ARM’s SOI libraries and EDA tool suppliers, a vast range of synthesizable IP is now easily portable to SOI technology and physical IP can be readily ported or designed using industry standard tools.”

IBM’s SOI technology with eDRAM is a key enabler for multi-core processors and other integrated circuits and can result in improved systems performance and energy savings for a range of applications including networking, printer, storage, consumer and mobile products.

“IBM was the first company to ship SOI products and we are now in our seventh generation of this leading technology,” said Michael Cadigan, general manager, IBM Microelectronics Division. “Through this collaboration with ARM, Cadence and other suppliers, we are providing an open design system and a proven supply chain to bring the significant performance and power-saving advantages of SOI technology to clients developing mobile and other system-on-chip applications.”

The SOI Industry Consortium invites all chip designers to evaluate the advantages of SOI for their next design by visiting the SOI Portal at www.ChipEstimate.com/SOI. Digital, analog and mixed-signal IP suppliers are invited to participate in listing their offerings on the SOI Portal. Designers worldwide are invited to register and attend the SOI Jump Start training on April 28, 2010 register now >>>, with the option of attending a live event in Silicon Valley hosted by Cadence, or online in a simulcast or recorded webinar.

About the SOI Industry Consortium:

The SOI Industry Consortium is chartered with accelerating silicon-on-insulator (SOI) innovation into broad markets by promoting the benefits of SOI technology and reducing the barriers to adoption. Providing a platform for global collaboration throughout the value chain, the SOI Industry Consortium’s membership includes: AMD, Applied Materials, ARM, Cadence Design Systems, CEA-Léti, Freescale Semiconductor, GLOBALFOUNDRIES, IBM, IMEC, Infotech, Innovative Silicon, Kanazawa Institute of Technology, KLA-Tencor, MEMC, Mentor Graphics, MIT Lincoln Laboratories, Nvidia, Ritsumeikan University, Samsung, Semico, SEH Europe, Soitec, Stanford University, STMicroelectronics, Synopsys, Tyndall Institute, University of California-Berkeley, University Catholique de Louvain, UMC and Varian. Membership is open to all companies and institutions throughout the electronics industry. For more information please visit www.soiconsortium.org.

Press Contacts:

Camille Darnaud-Dufour
+33 (0) 6 79 49 51 43
camille.darnaud-dufour@soiconsortium.org

Jeff Wolf
+1 925 989-6797
jeff.wolf@soiconsortium.org

Legal Note

The views and opinions expressed by the SOI Industry Consortium through officers in the SOI Industry Consortium or in this presentation or other communication vehicles are not necessarily representative of the views and opinions of individual members. Officers of the SOI Industry Consortium speaking on behalf of the Consortium should not be considered to be speaking for the member company or companies they are associated with, but rather as representing the views of the SOI Industry Consortium. Views and opinions are also subject to change without notice, and the SOI Industry Consortium assumes no obligation to update the information in this communication or accompanying discussions.

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