SOI Applications

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SOI Fundamentals

Chris Edwards explores the 'tricks' semiconductor device manufacturers are using to cope with shrinking feature sizes
[New Electronics]

SOI Technology
[ISU Electrical and Computer Engineering Archives]

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Process Technology

SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]

Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]

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Photonics

Ultra-high Speed, All-optical Wavelength Converters Using Single SOA and SOI Photonic Integrated Circuits
We report a new family of ultra-fast all-optical wavelength converters. The device architecture employs a single SOA and filtering elements integrated in silicon-on-insulator substrates. These schemes enable high-integration density and low power consumption. [Department of Information Technology (INTEC), Ghent University]

Device engineering for silicon photonics
[NPG Asia Materials]

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Power

A new integrated SOI power device based on self-isolation technology
[State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China]

NXP has launched the UBA2024 and UBA2024A integrated half-bridge power ICs, based on the company’s EZ-HV SOI technology
They enable the easy design of low-cost, very compact, high-reliability, long-life florescent lamp (CFL) applications. [NXP]

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Sensors/MEMS

How an SOI MEMS are built : MEMS first™ process
[SiTime]

A 12GHz bulk-micromachined RF-MEMS phase shifter by SOI layer-separation design
[IEICE Electronics Express]

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3D integration

Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin [Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]

Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability [EV Group (EVG)]

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Last post on February 03, 2012:

STMicroelectronics predicts its new SOI-based STOD13AS power chip could be used in nearly every new smartphone or small electronic device that has an AMOLED display

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#18 - Fall/Winter 2011/12
SOI on the Roadmaps

FD-SOI: ST & 28nm SOCs; ARM & design porting
Apps – NXP automotive sensors, AMD 32nm Bulldozer
SOI Conference (IBM, Intel, Leti, GloFo, ST, ARM, Peregrine & more)
SOI Consortium – FD-SOI whitepaper overview & excerpts

> Read the full edition

Press releases

SOI Industry Consortium announces first board of directors’ election results

New Executive Director, Horacio Mendez, Also Named

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in pdf format

BOSTON, MASS., January 15, 2008 – The SOI Industry Consortium, aimed at accelerating silicon-on-insulator (SOI) innovation into broad markets, announced today its first board of directors’ election results. At the same time the board named Horacio Mendez as the executive director of the newly formed organization.

Horacio Mendez has over 20 years of experience in the semiconductor industry. He was most recently the Director of New Product Development at Freescale Semiconductor where he was responsible for integrating SOI process technology and product design into solutions for the networking and computing microprocessor markets. He has driven the adoption and commercialization of multiple generations of products based on SOI technologies, while working closely with major OEMs.

In his role as the executive director, Mendez will manage the daily operations of the SOI Industry Consortium, ensuring the organization is focused on its vision, goals and commitment to deliver value to its members and the industry.

Technology leaders with a broad depth of industry experience and expertise comprise the SOI Industry Consortium Board of Directors. Working together with the Chair, the Treasurer and the Director, they will manage the strategic decisions of the Consortium, determine the broad lines of the organization’s activities and monitor implementation.

The SOI Industry Consortium Board consists of nine directors elected annually by the voting members. For the first year, the Chair and the Treasurer were elected by a majority of the Charter members prior to the consortium’s official launch on October 8, 2007.

The newly elected Board of Directors announced today includes:

• Udo Nothelfer, AMD (VP Fab 36)

• Tom Lantzch, ARM (VP Marketing PIPD Division; and Consortium Treasurer)

• Kevin Meyer, Chartered Semiconductor Manufacturing Ltd (VP Industry Marketing & Platform Alliances)

• Dirk Wristers, Freescale Semiconductor (Director, Process Technology R&D)

• Mark Ireland, IBM (VP Common Platform)

• André-Jacques Auberton-Hervé, Soitec (CEO and President; and Consortium Chair)

• Joel Hartmann, STMicroelectronics (Crolles2 Alliance Director)

• Ken Weng, TSMC (Deputy Director of SOI Design)

• Shieh-Wei Sun, UMC (COO)

About the SOI Industry Consortium:

The SOI Industry Consortium is chartered with accelerating silicon-on-insulator (SOI) innovation into broad markets by promoting the benefits of SOI technology and reducing the barriers to adoption. Representing leaders spanning the entire electronics industry infrastructure, SOI Industry Consortium charter members include: AMD, ARM, Cadence Design Systems, CEA-Léti, Chartered Semiconductor Manufacturing Ltd, Freescale Semiconductor, IBM, Innovative Silicon, KLA-Tencor, Lam Research, NXP, Samsung, Semico, Soitec, SEH Europe, STMicroelectronics, Synopsys, TSMC and UMC. Membership is open to all companies and institutions throughout the electronics industry.

Safe Harbor:

The views and opinions expressed by the SOI Industry Consortium through officers in the SOI Industry Consortium or in this presentation or other communication vehicles are not necessarily representative of the views and opinions of individual members. Officers of the SOI Industry Consortium speaking on behalf of the Consortium should not be considered to be speaking for the member company or companies they are associated with, but rather as representing the views of the SOI Industry Consortium. Views and opinions are also subject to change without notice, and the SOI Industry Consortium assumes no obligation to update the information in this communication or accompanying discussions.

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