SOI Applications

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SOI Fundamentals

Chris Edwards explores the 'tricks' semiconductor device manufacturers are using to cope with shrinking feature sizes
[New Electronics]

SOI Technology
[ISU Electrical and Computer Engineering Archives]

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Process Technology

SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]

Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]

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Photonics

Ultra-high Speed, All-optical Wavelength Converters Using Single SOA and SOI Photonic Integrated Circuits
We report a new family of ultra-fast all-optical wavelength converters. The device architecture employs a single SOA and filtering elements integrated in silicon-on-insulator substrates. These schemes enable high-integration density and low power consumption. [Department of Information Technology (INTEC), Ghent University]

Device engineering for silicon photonics
[NPG Asia Materials]

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Power

A new integrated SOI power device based on self-isolation technology
[State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China]

NXP has launched the UBA2024 and UBA2024A integrated half-bridge power ICs, based on the company’s EZ-HV SOI technology
They enable the easy design of low-cost, very compact, high-reliability, long-life florescent lamp (CFL) applications. [NXP]

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Sensors/MEMS

How an SOI MEMS are built : MEMS first™ process
[SiTime]

A 12GHz bulk-micromachined RF-MEMS phase shifter by SOI layer-separation design
[IEICE Electronics Express]

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3D integration

Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin [Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]

Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability [EV Group (EVG)]

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Last post on February 03, 2012:

STMicroelectronics predicts its new SOI-based STOD13AS power chip could be used in nearly every new smartphone or small electronic device that has an AMOLED display

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#18 - Fall/Winter 2011/12
SOI on the Roadmaps

FD-SOI: ST & 28nm SOCs; ARM & design porting
Apps – NXP automotive sensors, AMD 32nm Bulldozer
SOI Conference (IBM, Intel, Leti, GloFo, ST, ARM, Peregrine & more)
SOI Consortium – FD-SOI whitepaper overview & excerpts

> Read the full edition

Press releases

Applied Materials joins the SOI Industry Consortium

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BOSTON, MASS., February 18, 2008 – The SOI Industry Consortium announced today that Applied Materials, Inc. (Nasdaq: AMAT) has joined the organization as a full member. The SOI Industry Consortium, which was formed in October 2007 by a group of 19 leading companies from across the electronics industry, is aimed at accelerating silicon-on-insulator (SOI) innovation into broad markets by promoting the benefits of SOI technology and reducing the barriers to adoption.

Applied Materials, the global leader in Nanomanufacturing Technology™ solutions, brings the SOI Consortium membership to twenty companies covering a spectrum of users, enablers, suppliers and manufacturers. Other members include (listed alphabetically): AMD, ARM, Cadence Design Systems, CEA-Léti, Chartered Semiconductor Manufacturing, Freescale Semiconductor, IBM, Innovative Silicon, KLA-Tencor, Lam Research, NXP, Samsung, Semico, Soitec, SEH Europe, STMicroelectronics, Synopsys, TSMC and UMC.

“Applied Materials is a longtime supplier of equipment, manufacturing technology solutions and R&D resources to the SOI industry. We are very pleased to welcome them into this group of leading companies supporting the SOI ecosystem,” said André-Jacques Auberton-Hervé, Chairman of the board of the SOI Industry Consortium. “In addition to the performance advantages of SOI as a semiconductor substrate technology, SOI promises better energy efficiency. Applied Materials’ entry into the SOI Consortium supports the momentum we are gaining across the entire spectrum of the semiconductor market,” added Auberton-Hervé.

The SOI Industry Consortium is open to any company, organization or academic institution with an interest in SOI.

About the SOI Industry Consortium:
The SOI Industry Consortium is chartered with accelerating silicon-on-insulator (SOI) innovation into broad markets by promoting the benefits of SOI technology and reducing the barriers to adoption.
Representing leaders spanning the entire electronics industry infrastructure, SOI Industry Consortium members include: AMD, Applied Materials, ARM, Cadence Design Systems, CEA-Léti, Chartered Semiconductor Manufacturing Ltd, Freescale Semiconductor, IBM, Innovative Silicon, KLA-Tencor, Lam Research, NXP, Samsung, Semico, Soitec, SEH Europe, STMicroelectronics, Synopsys, TSMC and UMC. Membership is open to all companies and institutions throughout the electronics industry.

Press Contact:
Camille Darnaud-Dufour
Phone: +33 (0) 6 79 49 51 43
Email : camille.darnaud-dufour@soitec.com

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Legal note
The views and opinions expressed by the SOI Industry Consortium through officers in the SOI Industry Consortium or in this presentation or other communication vehicles are not necessarily representative of the views and opinions of individual members. Officers of the SOI Industry Consortium speaking on behalf of the Consortium should not be considered to be speaking for the member company or companies they are associated with, but rather as representing the views of the SOI Industry Consortium. Views and opinions are also subject to change without notice, and the SOI Industry Consortium assumes no obligation to update the information in this communication or accompanying discussions.

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