SOI Applications
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SOI Fundamentals
Chris Edwards explores the 'tricks' semiconductor device manufacturers are using to cope with shrinking feature sizes
[New Electronics]
SOI Technology
[ISU Electrical and Computer Engineering Archives]
Process Technology
SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]
Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]
Fully Depleted SOI
ST: FD-SOI for Competitive SOCs at 28nm and Beyond
[Advanced Substrate News]
Power, Performance, Cost. FDSOI lets you pick any three. Want proof? How about an ARM Cortex-M0 processor core example?
[EDA360 Insider]
Design/IP
Video interview of David Desharnais (Cadence) by Jeff Wolf (SOI Industry Consortium)
[Chipestimate.tv]
Analog/HV/RF
Peregrine's New SP5T RF Switch Offers High Isolation for Infrastructure Apps
[Consumer Electronics Net]
RF Micro Devices(R) Introduces First Silicon Switches for 3G Smartphones and Other High Performance Applications
[RF Micro Devices]
Photonics
Ultra-high Speed, All-optical Wavelength Converters Using Single SOA and SOI Photonic Integrated Circuits
We report a new family of ultra-fast all-optical wavelength converters. The device architecture employs a single SOA and filtering elements integrated in silicon-on-insulator substrates. These schemes enable high-integration density and low power consumption.
[Department of Information Technology (INTEC), Ghent University]
Device engineering for silicon photonics
[NPG Asia Materials]
Power
A new integrated SOI power device based on self-isolation technology
[State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China]
NXP has launched the UBA2024 and UBA2024A integrated half-bridge power ICs, based on the company’s EZ-HV SOI technology
They enable the easy design of low-cost, very compact, high-reliability, long-life florescent lamp (CFL) applications.
[NXP]
Sensors/MEMS
How an SOI MEMS are built : MEMS first™ process
[SiTime]
A 12GHz bulk-micromachined RF-MEMS phase shifter by SOI layer-separation design
[IEICE Electronics Express]
3D integration
Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin
[Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]
Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability
[EV Group (EVG)]
Last post on February 03, 2012:
STMicroelectronics predicts its new SOI-based STOD13AS power chip could be used in nearly every new smartphone or small electronic device that has an AMOLED display
#18 - Fall/Winter 2011/12
SOI on the Roadmaps
- FD-SOI: ST & 28nm SOCs; ARM & design porting
- Apps – NXP automotive sensors, AMD 32nm Bulldozer
- SOI Conference (IBM, Intel, Leti, GloFo, ST, ARM, Peregrine & more)
- SOI Consortium – FD-SOI whitepaper overview & excerpts
Press releases
The SOI Industry Consortium welcomes Magma as a new member
Download this press release
in pdf format
BOSTON, MASS., March 10, 2008 – The SOI Industry Consortium announced today that Magma® Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, has joined the organization as a technical member. With the addition of Magma, the SOI Industry Consortium now comprises 21 leading companies from across the electronics industry covering a spectrum of users, enablers, suppliers and manufacturers. The intitiative is aimed at accelerating silicon-on-insulator (SOI) adoption in a wide range of markets by promoting the benefits of SOI technology and reducing the barriers to adoption.
“We welcome Magma’s participation in the SOI Industry Consortium,” said André-Jacques Auberton-Hervé, chairman of the board of the SOI Industry Consortium. “With Magma’s expertise in developing design tools that address the low power, complexity and high-performance requirements of SOI-based chips, there is a natural convergence of interests with the consortium. The widening availability of tools and services is good news for designers in the fabless/foundry arena considering the move to SOI.”
The newest member of the SOI Industry Consortium, Magma Design Automation develops electronic design automation (EDA) software tools that enable integrated circuit designers to meet critical time-to-market objectives, improve chip performance and handle multimillion-gate designs. The other SOI consortium members include (listed alphabetically): AMD, Applied Materials, ARM, Cadence Design Systems, CEA-Léti, Chartered Semiconductor Manufacturing, Freescale Semiconductor, IBM, Innovative Silicon, KLA-Tencor, Lam Research, NXP, Samsung, Semico, Soitec, SEH Europe, STMicroelectronics, Synopsys, TSMC and UMC.
"Magma has worked very closely with leading SOI foundries and library suppliers," said Yatin Trivedi, Magma’s director of Industry Partnership Programs. "Magma already supports SOI characterization and timing methodology with our industry-standard SiliconSmart(R) characterization system, and our physical verification system, Quartz(TM) DRC, fully supports the requirements for SOI, and has runset support for 65-, 45- and 32-nanometer processes. Our participation as Technical Member in the SOI Consortium is an extension of these efforts."
The SOI Industry Consortium is open to any company, organization or academic institution with an interest in SOI.
About the SOI Industry Consortium
The SOI Industry Consortium is chartered with accelerating silicon-on-insulator (SOI) innovation into broad markets by promoting the benefits of SOI technology and reducing the barriers to adoption. Representing leaders spanning the entire electronics industry infrastructure, SOI Industry Consortium members include: AMD, Applied Materials, ARM, Cadence Design Systems, CEA-Léti, Chartered Semiconductor Manufacturing Ltd, Freescale Semiconductor, IBM, Innovative Silicon, KLA-Tencor, Lam Research, Magma, NXP, Samsung, Semico, Soitec, SEH Europe, STMicroelectronics, Synopsys, TSMC and UMC. Membership is open to all companies and institutions throughout the electronics industry.
Legal Note
The views and opinions expressed by the SOI Industry Consortium through officers in the SOI Industry Consortium or in this presentation or other communication vehicles are not necessarily representative of the views and opinions of individual members. Officers of the SOI Industry Consortium speaking on behalf of the Consortium should not be considered to be speaking for the member company or companies they are associated with, but rather as representing the views of the SOI Industry Consortium. Views and opinions are also subject to change without notice, and the SOI Industry Consortium assumes no obligation to update the information in this communication or accompanying discussions.
About Magma
Magma's software for designing integrated circuits (ICs) is used to create complex, high-performance chips required in cellular telephones, electronic games, WiFi, MP3 players, DVD/digital video, networking, automotive electronics and other electronic applications. Magma's EDA software for IC implementation, analysis, physical verification, circuit simulation and characterization is recognized as embodying the best in semiconductor technology, enabling the world's top chip companies to "Design Ahead of the Curve"™ while reducing design time and costs. Magma is headquartered in San Jose, Calif., with offices around the world. Magma's stock trades on Nasdaq under the ticker symbol LAVA. Visit Magma Design Automation on the Web at www.magma-da.com
Forward-looking Statements
Except for the historical information contained herein, the matters set forth in this press release, including statements about the features and benefits of Magma’s software are forward-looking statements within the meaning of the “safe harbor” provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are subject to risks and uncertainties that could cause actual results to differ materially including but not limited to the ability of Magma’s products to produce the desired results and the company’s ability to keep pace with rapidly changing technology. Further discussion of these and other potential risk factors may be found in Magma's public filings with the Securities and Exchange Commission (www.sec.gov). The company undertakes no additional obligation to update these forward-looking statements.
Magma and SiliconSmart are registered trademarks, and “Design Ahead of the Curve,” and Quartz are trademarks of Magma Design Automation Inc. All other product and company names are trademarks or registered trademarks of their respective companies.
Press Contacts
Camille Darnaud-Dufour
+33 (0) 6 9 49 51 43
camille.darnaud-dufour@soiconsortium.org
Monica Marmie
+ 1 (408) 565-7689
monical@magma-da.com
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