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Updated: June 6, 2013
Bulk vs SOI FinFET
[SOI Industry Consortium]
Chris Edwards explores the 'tricks' semiconductor device manufacturers are using to cope with shrinking feature sizes
[New Electronics]
SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]
Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]
Sheffield firm gets funding to develop low power SRAM for finfet processes
[Electronics Weekly]
Forum: FD-SOI Technology - April 22nd, 2013 - Hsinchu, Taiwan
[SOI Industry Consortium]
GlobalFoundries to Fab 28/20nm FD-SOI Chips for ST; ST Technology Open to Other GF Customers
[Advanced Substrate News]
Leti: Adding Strain to FD-SOI for 20nm and Beyond
[Advanced Substrate News]
High Voltage and High Reliability Silicon-on-Insulator Power IC Technologies and Their Application to 750 V 4.5 A Micro-Inverter IC
[Japanese Journal of Applied Physics 51 (2012)]
Smart power saves power
ST’s newest SOI-based smart power technology delivers big reductions in power consumption in medical equipment, hybrid-electric-vehicle chargers and more.
[Advanced Substrate News]
Imec and Genalyte have successfully developed and produced a set of disposable SOI-photonics biosensor chips for Genalyte’s diagnostic and molecular detection equipment
[Advanced Substrate News]
Photonics on the Move
SOI is at the heart of silicon photonics. Here’s an overview of past, present and future trends.
[Advanced Substrate News]
NovaThor SmartPhone Chip on 28nm FD-SOI: ST-Ericsson Blogger Tells All; PC Mag Sees Light
[Advanced Substrate News]
Leti: Adding Strain to FD-SOI for 20nm and Beyond
[Advanced Substrate News]
SiTime: Using SOI Technology to Develop High-Performance MEMS Timing Solutions
A radical SOI-based approach puts SiTime at the top of the fast-growing silicon-based timing market.
[Advanced Substrate News]
Imec and Genalyte have successfully developed and produced a set of disposable SOI-photonics biosensor chips for Genalyte’s diagnostic and molecular detection equipment
[Advanced Substrate News]
Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin
[Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]
Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability
[EV Group (EVG)]

American Semiconductor has announced the FleX-MCUâ„¢ product family.
#20 – Fall/Winter 2012/13
The Move to Fully-Depleted: Manufacturing, Economics, Design
Feb. 3, 2012 Semiconductor industry workshop to address fully depleted SOI technology for mobile and consumer electronics
Dec. 12, 2011 Results from leading semiconductor companies demonstrate the advantages of planar FD-SOI technology over bulk-silicon CMOS
Nov. 12, 2011 SOI Industry Consortium publishes technical paper on porting semiconductor designs from bulk silicon to FD-SOI
May. 6, 2010 BroadPak joins SOI Industry Consortium
SOI Industry Consortium confirms new board members
Mar. 23, 2010 Major semiconductor companies join forces to launch design chain solution for silicon-on-insulator technology
Mar. 16, 2010 MEMC joins the SOI Industry Consortium
Nov. 13, 2009 Mentor Graphics to join the SOI Industry Consortium
Oct. 21, 2009 The SOI Industry Consortium announces results of a SOI and bulk FinFETs comparison study
Oct. 8, 2009 SOI Industry Consortium announces SOI Design Clinic at ARM TechCon3
Jul. 22, 2009 SOI makes electronics simply greener
Press Launch Presentation (pdf)
Jun. 17, 2009 SOI Industry Consortium reinforces its academic and research support; three more prestigious universities join
Mar. 17, 2009 The SOI Industry Consortium announces key focus areas for 2009
Feb. 23, 2009 IMEC joins the SOI Industry Consortium
Dec. 11, 2008 Leading design house joins the SOI Industry Consortium
Nov. 6, 2008 The SOI Industry Consortium announces first general members' forum
Sep. 16, 2008 The SOI Industry Consortium launches SOI Implementation Guide
Jul. 31, 2008 The SOI Industry Consortium welcomes a key IP services provider
Jul. 16, 2008 NVIDIA joins the SOI Industry Consortium
Jun. 3, 2008 Global industry survey results reflect strong interest in SOI for low power at mainstream technology nodes
Mar. 10, 2008 The SOI Industry Consortium welcomes Magma as a new member
Feb. 18, 2008 Applied Materials joins the SOI Industry Consortium
Jan. 15, 2008 SOI Industry Consortium announces first board of directors’ election results
Oct. 8, 2007 19 electronics industry leaders join forces to accelerate SOI (silicon-on-insulator) innovation into broad markets
Oct. 7, 2007 Quote sheet: Consortium member spokespersons comment on their companies' participation as founding members
ARTICLE Sheffield firm gets funding to develop low power SRAM for finfet processes
[Electronics Weekly]
PRESENTATION Forum: FD-SOI Technology - April 22nd, 2013 - Hsinchu, Taiwan
[SOI Industry Consortium]
PRESENTATION Symposium: Fully Depleted Transistors Technology - December 10, 2012 – San Francisco, CA
[SOI Industry Consortium]
WHITE PAPER White paper: Innovative wafers for energy-efficient CMOS technology
ARTICLE DAC 2012: video interview of Horacio Mendez, Executive Director, SOI Industry Consortium
[EDACafe.com]