SOI Applications

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Updated: May 22, 2013

SOI Fundamentals

Bulk vs SOI FinFET
[SOI Industry Consortium]

Chris Edwards explores the 'tricks' semiconductor device manufacturers are using to cope with shrinking feature sizes
[New Electronics]

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Process Technology

SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]

Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]

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Smart power saves power
ST’s newest SOI-based smart power technology delivers big reductions in power consumption in medical equipment, hybrid-electric-vehicle chargers and more. [Advanced Substrate News]

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Photonics

Imec and Genalyte have successfully developed and produced a set of disposable SOI-photonics biosensor chips for Genalyte’s diagnostic and molecular detection equipment
[Advanced Substrate News]

Photonics on the Move
SOI is at the heart of silicon photonics. Here’s an overview of past, present and future trends. [Advanced Substrate News]

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Power

NovaThor SmartPhone Chip on 28nm FD-SOI: ST-Ericsson Blogger Tells All; PC Mag Sees Light
[Advanced Substrate News]

Leti: Adding Strain to FD-SOI for 20nm and Beyond
[Advanced Substrate News]

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Sensors/MEMS

SiTime: Using SOI Technology to Develop High-Performance MEMS Timing Solutions
A radical SOI-based approach puts SiTime at the top of the fast-growing silicon-based timing market. [Advanced Substrate News]

Imec and Genalyte have successfully developed and produced a set of disposable SOI-photonics biosensor chips for Genalyte’s diagnostic and molecular detection equipment
[Advanced Substrate News]

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3D integration

Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin [Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]

Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability [EV Group (EVG)]

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Last post on May 22, 2013 by Adele HARS:

More Good FD-SOI News from DATE Conference â€“ ST, Leti, Mentor, CMP

> Read this post

#20 – Fall/Winter 2012/13
The Move to Fully-Depleted: Manufacturing, Economics, Design

FD-SOI: ST/Chery interview; CMP's MPW runs; IBS on cost-savings
FD & wafers: SEH & Soitec
IBM's Fin-on-Oxide/FinFET
SOI Consortium – FD-SOI & wafer capacity for mobile

> Read the full edition

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