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#15 - Summer 2010
Getting ready for FD-SOI

• IBM, STM, Hitachi, Leti, Soitec on FD-SOI

• Special supplement: SOI Industry Consortium

• Medical apps: KEK, Hitachi, UCL, Nanosens

• IEEE fellows, Industry Buzz and more

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CEA-Leti STMicroelectronics UMC BroadPak KLA-Tencor Corporation Samsung IMEC Semico Infotech Berkeley, University of California

MEMC NVIDIA Shin-Etsu Handotai Freescale Semiconductor ARM Cadence Design Systems Kanazawa Institute of technology Stanford University MOSIS Soitec

GLOBALFOUNDRIES Ritsumeikan University Synopsys MIT Lincoln Laboratory Varian IBM Tyndall National Institute Mentor Graphics Universitι Catholique de Louvain Kanazawa Institute of technology

Fully Depleted SOI

Workshop: "Fully Depleted SOI", sponsored by Soitec and the SOI Consortium
December 2009 - Baltimore

Experts from around the world gather in Baltimore in December 2009 for a very lively debate on the progress and merits of Fully Depleted SOI. These are the experts' presentations:

• ETSOI substrate readiness for FDSOI (Dr. B. Doris, IBM)

• Models for FDSOI: BSIM, SPICE (Prof. C. Hu, Univ. California Berkeley)

• FDSOI Benefits for SRAM at the 22nm Node (Prof. T.J. King, Univ. California Berkeley)

• ARM 1176 implementation in SOI 45nm technology and silicon measurement and outlook towards FDSOI (Dr. Greg Yeric, ARM)