• Special supplement: SOI Industry Consortium
• SOI MEMS Apps
• IEDM Highlights

Jun. 17, 2009 SOI Industry Consortium reinforces its academic and research support; three more prestigious universities join
Mar. 17, 2009 The SOI Industry Consortium announces key focus areas for 2009
Feb. 23, 2009 IMEC joins the SOI Industry Consortium

Apr. 9, 2009 SOI technology & emerging applications
by Horacio Mendez, Executive Director of the SOI Industry Consortium

Jun. 18, 2009 Three prestigious universities join SOI Industry Consortium
[Fabtech]
Mar. 18, 2009 SOI coming into its own
[Compute Scotland]
Mar. 15, 2009 SOI draws line in the sand
[EuroAsia Semiconductor]

SOI technology: Semiconductor perception & awareness study
[Global Semiconductor Alliance (GSA) in collaboration with the SOI Industry Consortium]

Jun. 18, 2009 Thin SOI Devices Shine at VLSI Symposium
[Semiconductor International]
Jun. 9, 2009 Infineon and LS Industrial Systems Form Joint Venture to Forge Ahead in Molded Power Module Business for White Goods; Joint Venture to Accelerate Access to Power Module Market in Korea and Asia
[Infineon]
Jun. 9, 2009 Hynix and Innovative Silicon to Describe Memory Breakthrough at 2009 Symposium on VLSI Technology
[Innovative Silicon]
• Roadmap for nanometer ultra-low-power digital circuits based on sub/near-threshold CMOS logic [UC Louvain]
• Methodologies for comparing bulk and SOI process technologies for SoC designs [SOI Industry Consortium]
[Fujitsu]
Chi-Woo Lee, Aryan Afzalian, Nima Dehdashti Akhavan, Ran Yan, Isabelle Ferain, and Jean-Pierre Colinge [Applied Physics Letters, Vol. 94, pp. 053511:1-2: 2009-02-16]