SOI Applications

NEW Filter our 316 articles by market or company:

SOI Fundamentals

Process Technology

SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]

Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]

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Fully Depleted SOI

Design/IP

Analog/HV/RF

Photonics

Ultra-high Speed, All-optical Wavelength Converters Using Single SOA and SOI Photonic Integrated Circuits
We report a new family of ultra-fast all-optical wavelength converters. The device architecture employs a single SOA and filtering elements integrated in silicon-on-insulator substrates. These schemes enable high-integration density and low power consumption. [Department of Information Technology (INTEC), Ghent University]

Device engineering for silicon photonics
[NPG Asia Materials]

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Power

A new integrated SOI power device based on self-isolation technology
[State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China]

NXP has launched the UBA2024 and UBA2024A integrated half-bridge power ICs, based on the company’s EZ-HV SOI technology
They enable the easy design of low-cost, very compact, high-reliability, long-life florescent lamp (CFL) applications. [NXP]

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Sensors/MEMS

3D integration

Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin [Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]

Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability [EV Group (EVG)]

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Advanced Substrate News

Last post on January 27, 2012:

The internationalSematech consortium announced that SOI wafer leader Soitec has joined the Front End Processes (FEP) and Advanced Metrology Programs

> Read this post

#18 - Fall/Winter 2011/12
SOI on the Roadmaps

  • FD-SOI: ST & 28nm SOCs; ARM & design porting
  • Apps – NXP automotive sensors, AMD 32nm Bulldozer
  • SOI Conference (IBM, Intel, Leti, GloFo, ST, ARM, Peregrine & more)
  • SOI Consortium – FD-SOI whitepaper overview & excerpts

> Read the full edition

Hot news

ARTICLE Intel Delays Finfets
[Electronics Weekly]

ARTICLE ST: FD-SOI for Competitive SOCs at 28nm and Beyond
[Advanced Substrate News]

ARTICLE White paper: Considerations for Bulk CMOS to FD-SOI Design Porting
[SOI Industry Consortium]

ARTICLE Workshop: Fully Depleted SOI - April 28, 2011 - Hsinchu, Taiwan
[SOI Industry Consortium]

PUBLICATION Planar FD-SOI CMOS: The Competitive Advantage Mobile Silicon Technology
[SOI Industry Consortium]

PRESENTATION Evaluation of Fully-Depleted SOI for next generation Mobile Consumer Chips
[Horacio Mendez, Executive Director, SOI Industry Consortium]

White papers

White paper: Considerations for Bulk CMOS to FD-SOI Design Porting
[SOI Industry Consortium]

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2012 IEEE International SOI Conference Intel Delays Finfets Considerations for Bulk CMOS to FD-SOI Design Porting FDSOI/ARM Performances FDSOI Articles MEMC Perfect SOI

 

Watch all videos from the Jump Start Training event.

View and listen to the SOI training modules.

> SOI Self Heating (Bob Ulicki, September 2009)

> SOI I/O Design (Bob Ulicki, September 2009)

> SOI - The "Floating" Body (Bob Ulicki, September 2009)

> Designing with SOI SRAMs (Bob Ulicki, October 2009)

Download the presentations of the October 21, 2009 conference.

Introduction
by Horacio Mendez, SOI Industry Consortium

SOI Fundamentals
by Bob Ulicki, SOI Industry Consortium

Designing Low Power Circuits on SOI
by Olivier Thomas, CEA-Leti

Designing High Performance Microprocessors on SOI
by Nghia Phan, IBM

> More presentations