NEW Filter our 316 articles by market or company:
Chris Edwards explores the 'tricks' semiconductor device manufacturers are using to cope with shrinking feature sizes
[New Electronics]
SOI Technology
[ISU Electrical and Computer Engineering Archives]
SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]
Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]
ST: FD-SOI for Competitive SOCs at 28nm and Beyond
[Advanced Substrate News]
Power, Performance, Cost. FDSOI lets you pick any three. Want proof? How about an ARM Cortex-M0 processor core example?
[EDA360 Insider]
Video interview of David Desharnais (Cadence) by Jeff Wolf (SOI Industry Consortium)
[Chipestimate.tv]
Peregrine's New SP5T RF Switch Offers High Isolation for Infrastructure Apps
[Consumer Electronics Net]
RF Micro Devices(R) Introduces First Silicon Switches for 3G Smartphones and Other High Performance Applications
[RF Micro Devices]
Ultra-high Speed, All-optical Wavelength Converters Using Single SOA and SOI Photonic Integrated Circuits
We report a new family of ultra-fast all-optical wavelength converters. The device architecture employs a single SOA and filtering elements integrated in silicon-on-insulator substrates. These schemes enable high-integration density and low power consumption.
[Department of Information Technology (INTEC), Ghent University]
Device engineering for silicon photonics
[NPG Asia Materials]
A new integrated SOI power device based on self-isolation technology
[State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China]
NXP has launched the UBA2024 and UBA2024A integrated half-bridge power ICs, based on the company’s EZ-HV SOI technology
They enable the easy design of low-cost, very compact, high-reliability, long-life florescent lamp (CFL) applications.
[NXP]
How an SOI MEMS are built : MEMS first™ process
[SiTime]
A 12GHz bulk-micromachined RF-MEMS phase shifter by SOI layer-separation design
[IEICE Electronics Express]
Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin
[Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]
Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability
[EV Group (EVG)]

Last post on January 27, 2012:
The internationalSematech consortium announced that SOI wafer leader Soitec has joined the Front End Processes (FEP) and Advanced Metrology Programs
#18 - Fall/Winter 2011/12
SOI on the Roadmaps
ARTICLE Intel Delays Finfets
[Electronics Weekly]
ARTICLE ST: FD-SOI for Competitive SOCs at 28nm and Beyond
[Advanced Substrate News]
ARTICLE White paper: Considerations for Bulk CMOS to FD-SOI Design Porting
[SOI Industry Consortium]
ARTICLE Workshop: Fully Depleted SOI - April 28, 2011 - Hsinchu, Taiwan
[SOI Industry Consortium]
PUBLICATION Planar FD-SOI CMOS: The Competitive Advantage Mobile Silicon Technology
[SOI Industry Consortium]
PRESENTATION Evaluation of Fully-Depleted SOI for next generation Mobile Consumer Chips
[Horacio Mendez, Executive Director, SOI Industry Consortium]
White paper: Considerations for Bulk CMOS to FD-SOI Design Porting
[SOI Industry Consortium]
Watch all videos from the Jump Start Training event.
View and listen to the SOI training modules.
• > SOI Self Heating (Bob Ulicki, September 2009)
• > SOI I/O Design (Bob Ulicki, September 2009)
• > SOI - The "Floating" Body (Bob Ulicki, September 2009)
• > Designing with SOI SRAMs (Bob Ulicki, October 2009)
Download the presentations of the October 21, 2009 conference.
• Introduction
by Horacio Mendez, SOI Industry Consortium
• SOI Fundamentals
by Bob Ulicki, SOI Industry Consortium
• Designing Low Power Circuits on SOI
by Olivier Thomas, CEA-Leti
• Designing High Performance Microprocessors on SOI
by Nghia Phan, IBM