SOI ‐ 
The 
next 
five 
years: The
 critical 
role 
that 
SOI 
will 
play 
in 
the
 semiconductor 
market

Euro
SOI
 2010
 - Grenoble, 
France
 [Horacio Mendez, Executive Director, SOI Industry Consortium]

CMOS Transitions to 22 and 15 nm
Scaling beyond the 22 nm node is likely to require fully depleted CMOS, either on SOI or bulk wafers [Semiconductor International]

IBM Gains Confidence in 22 nm ETSOI
[Semiconductor International]

Presentation: Silicon results of ARM core 1176 in SOI – A 40% power reduction
[by Remy Pottier, Jonathan Tong, Chris Hawkins, Roma Kundu and Jean-Luc Pelloie, ARM]

Nov. 13, 2009 Mentor Graphics to join the SOI Industry Consortium

» more consortium news

Nov. 24, 2009 Mentor joins SOI consortium
[EE Times]

Nov. 13, 2009 Mentor Graphics joins SOI consortium
[EE Times]

Nov. 13, 2009 Mentor joins SOI Industry Consortium
[EDN]

Nov. 1, 2009 Comparing SOI and bulk FinFETs: Performance, manufacturing variability, and cost
[Solid State Technology]

Oct. 13, 2009 ARM teaches world how to use SOI process technology
[Electronics Weekly]

» more articles

The Truth About Power and Process Technology
[Horacio Mendez, Executive Director, SOI Industry Consortium]

Low-Power Design with Material Impact on Silicon-on-Insulator Technology
[Horacio Mendez, Executive Director, SOI Industry Consortium]

SOI – Integrated Technology, IP and Design Flow for Customer Success
[Gordon Starkey, IBM Systems & Technology Group; David Desharnais, Group Marketing Director, Cadence Design Systems; Tom Lantzch, VP Marketing, ARM]

Jan. 28, 2010 Remaking the design landscape
[System-Level Design]

Jan. 12, 2010 EUROSOI 2010 conference announces keynote presenters and technical program
[EUROSOI]

Nov. 27, 2009 Soitec CEO sees positive momentum in SOI markets
[EE Times]

» more articles