SOI Applications

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Updated: April 30, 2012

SOI Fundamentals

Process Technology

SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]

Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]

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Fully Depleted SOI

Design/IP

NEW Leti: Adding Strain to FD-SOI for 20nm and Beyond
[Advanced Substrate News]

Interview With ST-Ericsson's Chief Chip Architect: SOCs on 28nm FD-SOI – When, Why and How
ST-Ericsson's Chief Chip Architect Louis Tannyeres talks with ASN about the move to 28nm FD-SOI for smartphones and tablet SOCs. [Advanced Substrate News]

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Analog/HV/RF

Photonics

Ultra-high Speed, All-optical Wavelength Converters Using Single SOA and SOI Photonic Integrated Circuits
We report a new family of ultra-fast all-optical wavelength converters. The device architecture employs a single SOA and filtering elements integrated in silicon-on-insulator substrates. These schemes enable high-integration density and low power consumption. [Department of Information Technology (INTEC), Ghent University]

Device engineering for silicon photonics
[NPG Asia Materials]

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Power

NEW Leti: Adding Strain to FD-SOI for 20nm and Beyond
[Advanced Substrate News]

Interview With ST-Ericsson's Chief Chip Architect: SOCs on 28nm FD-SOI – When, Why and How
ST-Ericsson's Chief Chip Architect Louis Tannyeres talks with ASN about the move to 28nm FD-SOI for smartphones and tablet SOCs. [Advanced Substrate News]

> More articles

Sensors/MEMS

SiTime: Using SOI Technology to Develop High-Performance MEMS Timing Solutions
A radical SOI-based approach puts SiTime at the top of the fast-growing silicon-based timing market. [Advanced Substrate News ]

How an SOI MEMS are built : MEMS first™ process
[SiTime]

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3D integration

Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin [Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]

Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability [EV Group (EVG)]

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Advanced Substrate News

Last post on May 02, 2012:

Consortium Website – What’s New

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#19 – Spring/Summer 2012
Special Edition: FD-SOI Industrialization

  • Technology: ST/Soitec white paper excerpts
  • Apps – ST-Ericsson's NovaThor at 28nm (interview)
  • 20nm & Beyond: Chenming Hu; Leti
  • Wafers: Soitec's Roadmap
  • SOI Consortium – benchmarking

> Read the full edition

ST-ERICSSON announces next-gen Novathor at 28nm, on FD-SOI 20nm FD SOI logic evaluation model cards available 2012 IEEE International SOI Conference FDSOI/ARM Performances FDSOI Articles

 

Watch all videos from the Jump Start Training event.

View and listen to the SOI training modules.

> SOI Self Heating (Bob Ulicki, September 2009)

> SOI I/O Design (Bob Ulicki, September 2009)

> SOI - The "Floating" Body (Bob Ulicki, September 2009)

> Designing with SOI SRAMs (Bob Ulicki, October 2009)

Download the presentations of the October 21, 2009 conference.

Introduction
by Horacio Mendez, SOI Industry Consortium

SOI Fundamentals
by Bob Ulicki, SOI Industry Consortium

Designing Low Power Circuits on SOI
by Olivier Thomas, CEA-Leti

Designing High Performance Microprocessors on SOI
by Nghia Phan, IBM

> More presentations