SOI Applications

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Updated: May 22, 2013

SOI Fundamentals

Process Technology

SOI Scalability
[by Harry Gries, ASIC Methodology and EDA Technology Consultant]

Hot carrier injection from nanometer-thick silicon-on-insulator films measured by optical second-harmonic generation
[Applied Physics Letters, Vol. 96, Issue 24]

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Fully Depleted SOI

Design/IP

Analog/HV/RF

High Voltage and High Reliability Silicon-on-Insulator Power IC Technologies and Their Application to 750 V 4.5 A Micro-Inverter IC
[Japanese Journal of Applied Physics 51 (2012)]

Smart power saves power
ST’s newest SOI-based smart power technology delivers big reductions in power consumption in medical equipment, hybrid-electric-vehicle chargers and more. [Advanced Substrate News]

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Photonics

Imec and Genalyte have successfully developed and produced a set of disposable SOI-photonics biosensor chips for Genalyte’s diagnostic and molecular detection equipment
[Advanced Substrate News]

Photonics on the Move
SOI is at the heart of silicon photonics. Here’s an overview of past, present and future trends. [Advanced Substrate News]

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Power

Sensors/MEMS

3D integration

Wireless Interconnects for Inter-tier Communication on 3D ICs
By Ankit More and Baris Taskin [Department of Electrical and Computer Engineering, Drexel University 3141 Chestnut Street, Philadelphia, Pennsylvania 19104, USA]

Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability [EV Group (EVG)]

> More articles

Advanced Substrate News

Last post on May 23, 2013:

The FD-SOI design and manufacturing ecosystem has just gotten a €360M boost.

> Read this post

#20 – Fall/Winter 2012/13
The Move to Fully-Depleted: Manufacturing, Economics, Design

  • FD-SOI: ST/Chery interview; CMP's MPW runs; IBS on cost-savings
  • FD & wafers: SEH & Soitec
  • IBM's Fin-on-Oxide/FinFET
  • SOI Consortium – FD-SOI & wafer capacity for mobile

> Read the full edition

White papers

White paper: Innovative wafers for energy-efficient CMOS technology
By Xavier Cauchy, Digital Applications and Strategic Marketing, Soitec

White paper: Economic impact of the technology choices at 28nm/20nm
A white paper By Dr. Handel Jones, Founder and CEO of IBS, Inc. (Los Gatos, California)

White paper: Planar fully depleted silicon technology to design competitive SOC at 28nm and beyond
This document considers the challenges to obtain competitive silicon technology for the upcoming generation of System-On-Chip ICs. It suggests planar fully depleted technology deserves serious interest. After outlining some implementation choices, a number of circuit-level benchmark results as well as some important design aspects are presented. It is found that this technology combines high performance, power efficiency and cost-effectiveness, which makes it a very attractive candidate to serve the needs of mobile and consumer multimedia SOCs starting at the 28nm node and scalable down to 14nm.
[STMicroelectronics, Soitec]

White paper: Considerations for Bulk CMOS to FD-SOI Design Porting
The scope of this study is to examine the efforts required for a straight “port” of an existing bulk CMOS design to FD-SOI at the same node. The objective would be to get value from FD-SOI for a modest redesign effort – even if this means not necessarily taking maximum advantage of the potentialities of FD-SOI. The focus is on FD-SOI with Ultra-Thin Buried Oxide. This document intends to be sufficiently generic to be applicable to different possible implementations of the FD-SOI technology by foundries.
[SOI Industry Consortium]

White paper: Fully Depleted SOI - Designed for low power
FULLY DEPLETED SOI is a CMOS silicon technology specifically designed to operate at very low power while maximizing performance, manufacturability and reducing the overall cost.
[Horacio Mendez, Executive Director, SOI Industry Consortium]

White paper: Forecasted impact of FD SOI technology on design
As potential users of Fully Depleted Silicon-on-Insulator (FD-SOI) technology for the 22nm/20nm CMOS node and beyond realize its many interests, the question of its impact on design practices arises. Although FD-SOI for next generation technology nodes is not on commercial offer yet, it is nevertheless important to bring early answers or indications to that question. This document therefore proposes a synthesis of what is known or can be reasonably expected from FD-SOI from a design perspective, and indicates some interesting new potentialities that designers may be able to exploit.
[By Xavier CAUCHY, Digital Application Manager, Soitec]

White paper: Questions and answers on FD SOI technology
This document is a high level introduction to FD-SOI technology and its applicability to next technology nodes, in the form of a few key questions and their quick answers. No deep technical details are provided here, however Question 15 provides some relevant links. Short answers are provided first (hypertext links are provided, just click on the question of interest), followed by slightly more detailed answers for the interested readers.
[By Xavier CAUCHY, Digital Applications Manager, Soitec, with François ANDRIEU, Senior Research Engineer, LETI]

White paper on Silicon On Insulator (SOI) implementation
by Narayana Murty Kodeti
[Infotech Enterprises Ltd.]